Nan Ya Technology Corporation

Nanya Technologies Corporation

Feng-Ju Tsai

Shyue-Ru Doong

A method includes the following steps. A wafer is disposed on a wafer-mounting surface of a wafer holder that is disposed in a chamber. The wafer-mounting surface is in parallel with a gravity direction. A gas is flown from a gas source to vacuum sealing device. An inductive coil wrapping around a vacuum sealing device excites the gas into plasma. The plasma is injected to the wafer.

Operating method of etching device

A cellular network includes multiple miniature base stations. The miniature base stations are communicatively connected to each other. Each one of the miniature base stations includes an antenna, a wireless signal transceiver and a digital signal processor. The antenna is arranged at a peripheral area of the miniature base stations and configured to receive and to transmit wireless signals. The wireless signal transceiver is configured to demodulate the wireless signals received from the antenna and to modulate the wireless signals transmitted by the antenna. The digital signal processor is configured to process the wireless signals, which are demodulated or modulated.

Cellular network

The present disclosure provides an alert device and an alert method. The alert device includes an image capturing unit, an input/output unit and a processing unit. The image capturing unit is configured to capture at least one image of a wafer transportation system. The processing unit is configured to: retrieve the at least one image from the image capturing unit; define a first boundary in the at least one image; identify a wafer chuck of the wafer transportation system in the at least one image; determine whether the wafer chuck intersects the first boundary in the at least one image; and transmit an alert signal to the wafer transportation system via the input/output unit when the wafer chuck is determined to intersect the first boundary in the at least one image.

Alert device and alert method thereof

A wafer cleaning apparatus includes a spin base, a first arm, and a second arm. The spin base is configured to support a wafer. The first arm is disposed above the spin base and configured to supply a chemical solution. The second arm is movably positioned above the spin base, and the second arm is configured to supply a first cleaning solution above the spin base when the first arm abnormally stops supplying the chemical solution.

Wafer cleaning apparatus and operation method of the same

The present disclosure provides systems and methods for controlling a semiconductor manufacturing equipment. The control system includes an inspection unit capturing a set of images of the semiconductor manufacturing equipment, a sensor interface receiving the set of images and generating at least one input signal for a database server, and a control unit. The control unit includes a front end subsystem, a calculation subsystem, and a message and feedback subsystem. The calculation subsystem receives the data signal from the front end subsystem, wherein the calculation subsystem performs an artificial intelligence analytical process to determine, according to the data signal, whether a malfunction has occurred in the semiconductor manufacturing equipment and to generate an output signal. The message and feedback subsystem generates an alert signal and a feedback signal according to the output signal, and the alert signal is transmitted to a user of the semiconductor manufacturing equipment.

System and method for controlling semiconductor manufacturing equipment

The present disclosure provides a wafer cleaning apparatus and a cleaning method. The wafer cleaning apparatus includes a tank and a wafer holder. The tank includes a bottom wall, a lateral wall, and a partition wall. The lateral wall is connected to the bottom wall. The partition wall is movably mounted on the lateral wall and divides a cleaning space defined by the bottom wall and the lateral wall into a first compartment and a second compartment. A passage communicating with the first compartment and the second compartment is formed when the partition wall is moved away from the bottom wall and immersed in a cleaning fluid received in the cleaning space. The wafer holder is adapted to be immersed in the cleaning fluid and to move between the first compartment and the second compartment. The present disclosure further provides a method of cleaning the wafer.

Wafer cleaning apparatus and method of cleaning wafer

A device includes a wafer chuck, a first nozzle, an actuator, and a first elongated cup. The first nozzle is disposed over the wafer chuck. The first elongated cup is coupled to the actuator. The actuator is capable of moving the first elongated cup from a first position to a second position. The first elongated cup shields the first nozzle from the wafer chuck at the first position. The first elongated cup is free of shielding the first nozzle from the wafer chuck at the second positon.

Wet cleaning apparatus and manufacturing method using the same

A wafer drying equipment includes a base, a casing and a microwave generator. The base is configured to support a wafer. The casing forms a chamber with the base. The chamber is configured to accommodate the wafer. The casing has an exhaust vent away from the base. The microwave generator is disposed on the casing and is configured to emit a microwave to the chamber.

Growing community of inventors

Hsinchu County, Taiwan

Feng-Ju Tsai