Self Electronics Co., Ltd.

Hangzhou Silan Integrated Circuit Co., Ltd.

Hangzhou Silan Microelectronics Co., Ltd.

Hangzhou Silan Integrated Circuits Co., Ltd.

Feng Ji

Zhaoyong Zheng

Chen Liu

Yongxiang Wen

Huangfeng Pan

Bozhang Xu

Liwen Li

Yuanfang Xue

Wanjiong Lin

Chengke Zhang

Junjun Ying

Changjun Zhang

Fawei Zhang

Le Xu

Wen Wang

Ping Wang

Lin Ye

XiaoLi Zhang

Zuyin Chen

A refrigerator supporting rod for installing lighting device has a rod body, the rod body having an inner side surface facing toward the refrigerator and an outer side surface back toward the refrigerator, a heat insulating layer is provided between the inner side surface and the outer side surface, the inner side surface is provided with a lamp mounting groove extending in the longitudinal direction. According to the refrigerator supporting rod for installing lighting device, a lamp can be installed in an embedded mode to integrate the two, so that the probability of touching the lamp is reduced, and the likelihood of damage is reduced.

Refrigerator supporting rod for installing lighting device

A plug-in structure has at least one set of male plugs and female plugs that are mated, wherein the male plug has a pin, and the female plug includes: a mounting base, which is provided with a mounting channel for inserting the pin; multiple sets of reeds, arranged in the mounting channel at intervals along the length direction of the mounting channel for clamping the pin. A lamp can be made with the plug-in structure. According to the plug-in structure and the lamp with the plug-in structure, the multi-stage reeds are arranged in the mounting channels to clamp the pins, so that the pins can be kept straight and flat and are not prone to deforming, the insertion and extraction force can be increased, and the assembly failure rate can be reduced.

Plug-in structure and a lamp using the plug-in structure

An LED flexible strip lamp has a strip lamp holder, a conductive flexible strip, an LED flexible strip and a lamp cap, the LED flexible strip includes a first bonding pad disposed at its end, the conductive flexible strip includes a flexible insulating sheet, a conductive metal foil, a second bonding pad; the lamp cap includes an internal connector, and the internal connector includes an elastic conductive member abutting against the conductive metal foil. a conductive member with the bonding pad is arranged to be welded to the LED flexible strip so as to be matched with the lamp holder in an inserted mode, automation can be achieved conveniently, and the problem that an original LED flexible strip lamp is low in production efficiency due to the fact that the lamp holder needs to be installed manually is solved.

LED flexible strip lamp and manufacturing method thereof

The invention discloses a freezer frame comprising a frame body, the frame body includes a low-temperature part and a heating part, and a panel installed in cooperation with the frame is provided on the heating part, characterized in that, a light source is provided on the low-temperature part, and a heat conduction channel is provided between the light source and the heating part. The freezer frame and the freezer of the present invention use the heat of the light source for lighting to heat the panel to prevent the panel from fogging and generating condensed water, prevent the freezer door and frame from freezing, and simplify the structure to reduce energy consumption and manufacturing costs.

Freezer frame with low temperature and heated parts

Disclosed a MEMS assembly and a manufacturing method thereof. The manufacturing method comprises: forming a groove on a sensor chip; forming a bonding pad on a circuit chip; bonding the sensor chip and the circuit chip together to form a bonding assembly; performing a first dicing process at a first position of the sensor chip to penetrate through the sensor chip to the groove; performing a second dicing process at a second position of the sensor chip to penetrate through the sensor chip and the circuit chip, for obtaining an individual MEMS assembly by singulating the bonding assembly, wherein location of the groove corresponds to a position of the bonding pad, and an opening is formed in the sensor chip to expose the bonding pad when the second dicing process is performed. The method uses two dicing process respectively achieving different depths to expose the bonding pad of the sensor chip and singulate the MEMS assembly, respectively, to improve yield and reliability.

MEMS assembly and manufacturing method thereof

A lighting lamp has a lamp body and an end cover assembly, the lamp body includes a strip lamp holder, a circuit board, a light source, a optical lens and two reflecting barriers; the reflecting barriers and the optical lens are integrally formed, and the bottom of the reflecting barriers presses the top surface of the circuit board when the optical lens is fixedly connected to the strip lamp holder. The present invention has a simple and compact structure, and is easy to assemble, the assembly process takes up less space, and is more suitable for automated production.

Lighting lamp

A tubular LED light fixture includes a lamp holder; printed circuit board; a plurality of point light sources; lens; strip-shaped convex lens array, located between the lens and printed circuit board and arranged along the length direction of the tubular LED light fixture for converting each point light source into a plurality of consecutive sub point light sources, and the sub point light source converted by the adjacent point light source is connected or overlapped. The invention adopts a strip-shaped convex lens array which forms a line light source only by diffusing light from the point light source only in the length direction of the strip light fixture, preventing light from diffusing in multiple directions, so that the line source is purified. The lens is arranged to perform light distribution in the other direction to the line source, thereby reducing energy attenuation and ensuring the light effect.

Tubular LED fixture

The present invention relates to a lamp installation component comprising a clamping assembly for clamping on part to be clamped, and a mounting frame for assembling the lamp; the clamping assembly includes fixed part, abutting part, movable part and elastic part, and the fixed part is relatively fixed with the abutting part, and the movable part is slidably disposed between the fixed part and the abutting part, and the elastic part is held between the movable part and the abutting part, so that the movable part has a tendency to form a clamped state close to the fixed part; the mounting frame is fixedly connected to the abutting part. The lamp installation component has a simple structure and can be installed or disassembled with one hand, and is more convenient for use in a showcase or other small installation space.

Lamp installation component

A strip-shaped LED interconnected high-voltage lamp comprising an assembly groove, a lamp cover, a connector assembly, and a light source assembly. The assembly groove includes two wire assembly grooves. The wire assembly groove is curved and the central angle of the arc is greater than 180 degrees. The lamp cover is integrally formed with the assembly groove. The connector assembly includes a connector body that is inserted into the assembly groove, and two conductive sheets that are fixedly disposed in the connector body. The length of the conductive sheet in the extending direction of the assembly groove is greater than the length of the connector body and protrudes from both ends of the connector body. The conductive sheet coincides with a central axis of the wire assembly groove in an extending direction of the assembly groove. The strip-shaped LED interconnected high-voltage lamp provided by the invention can realize interconnection and can directly connect to high voltage electricity, so that the application range thereof is wide. At the same time, due to the structural arrangement of the assembly groove, the connector assembly, and the light source assembly, and the assembly of different fasteners of the strip-shaped LED interconnected high-voltage lamp can be completed.

Strip-shaped LED interconnected high-voltage lamp

A strip lamp made for easy assembly and disassembly contains a U-shaped groove body and a cover made for covering the groove body. The groove body and the cover are attached by a latch on the cover and a matching lock on the groove body on one side, and a pivot made by a V-shaped groove on the cover on the other side. Assembly can be conducted without the use of fasteners so that the strip lamp may be easily assembled.

Strip lamp, assembly method and disassembly method thereof

A light distribution system for freezer that includes a LED strip light disposed on a freezer door. The LED strip lamp includes a lamp holder, a strip-shaped polarizing lens, and a plurality of LED chips. The lamp holder includes a lens setting surface and a reflecting surface. The strip-shaped polarizing lens includes a plurality of optical axis, an incident surface, a first and second convex lens exit surfaces, and a transition surface. An angle between the illuminated surface and the optical axis includes an acute angle and the illuminated surface includes a main light region illuminated by the outgoing light of the first and second convex lens exit surfaces and a sub-light region illuminated by the reflected light from the reflecting surface.

Light distribution system for freezer

A lamp, including a lamp cover, the lamp cover is in the shape of a strip having openings at both ends, and the lamp cover is respectively provided with two side walls and a top surface along a direction away from the light emitting surface, and the two side walls and the top surface form an accommodating cavity; a PCB board, the PCB board being mounted in the accommodating cavity along the length direction of the lamp cover; the lamp also includes a conductive component connected to an external power supply, and the conductive component is electrically connected to the PCB board.

Lamp

A multiple silicon trenches forming method and an etching mask structure, the method comprises: step S, providing a MEMS sealing cap silicon substrate (); step S, forming n stacked mask layers () on the MEMS sealing cap silicon substrate (), after forming each mask layer, photolithographing and etching the mask layer and all other mask layers beneath the same to form a plurality of etching windows (D, D, D); step S, etching the MEMS sealing cap silicon substrate by using the current uppermost mask layer and a layer of mask material beneath the same as a mask; step S, removing the current uppermost mask layer; step S, repeating the step Sand the step Suntil all the n mask layers are removed. The present invention can form a plurality of deep trenches with high aspect ratio on the MEMS sealing cap silicon substrate using conventional semiconductor processes, avoiding the problem that the conventional spin coating cannot be conducted on a sealing cap wafer with deep trenches using photoresist.

Multiple silicon trenches forming method for MEMS sealing cap wafer and etching mask structure thereof

The present disclosure relates to a dielectrically isolated semiconductor device and a method for manufacturing the same. The dielectrically isolated semiconductor device includes a semiconductor substrate, a first semiconductor layer above the semiconductor substrate, a second semiconductor layer above the first semiconductor layer, a semiconductor island in the second semiconductor layer, and a first dielectric isolation layer surrounding a bottom and sidewalls of the semiconductor island. The first dielectric isolation layer includes a first portion which is formed from a portion of the first semiconductor layer and extending along the bottom of the semiconductor island, and a second portion which is formed from a portion of the second semiconductor layer and extending along the sidewalls of the semiconductor island. The dielectrically isolated semiconductor devices needs no an SOI wafer and reduces manufacturing cost.

Dielectrically isolated semiconductor device and method for manufacturing the same

A ultra-thin LED bar lights includes a bar house, a light module, a reflection film, a light guide plate, and a cover having a light transmittance less than 90%. An angle between the circuit board and the accessory placed board being larger than 80 degrees and less than 90 degrees. The light guide plate includes an incidence wall for receiving the emitted light of the light module, three reflective walls for reflecting light, and a diffusion surface contacting with the reflection film. A width of the diffusion surface of the light guide plate is between 3 times or 4 times the length or the maximum diameter of the LED chips and provides a plurality of light guide points thereon. The light guide points include a plurality of spaced apart circular dots, the total area of which is 50% to 55% of the total area of the diffusion surface.

Growing community of inventors

Zhejiang, China

Feng Ji