Cabot Microelectronics Corporation

Feng-Chih Hsu

Jia-Cheng Hsu

Sheng-Huan Liu

Shi-Wei Cheng

Ching-Ming Tsai

Kun-Shu Yang

Craig Kokjohn

The invention provides a polishing pad and a method of using the polishing pad for chemically-mechanically polishing a substrate. The polishing pad comprises a plurality of grooves composed of at least a first plurality of concentric grooves having a first center of concentricity, and a second plurality of concentric grooves having a second center of concentricity. The first center of concentricity is not coincident with the second center of concentricity, the axis of rotation of the polishing pad is not coincident with at least one of the first center of concentricity and the second center of concentricity, the plurality of grooves does not consist of a continuous spiral groove, and the polishing surface does not comprise a mosaic groove pattern.

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Aurora, IL, United States of America

Feng-Chih Hsu