Canon Kabushiki Kaisha

Molecular Imprints, Inc.

University of Texas System

Canon Nanotechnologies, Inc.

Fen Wan

Weijun Liu

Timothy Brian Stachowiak

Frank Y Xu

Toshiki Ito

Sidlgata V Sreenivasan

Gerard M Schmid

Michael Nevin Miller

Niyaz Khusnatdinov

Shuqiang Yang

Mohamed M Hilali

Liang Kai Wang

Fei Li

Gary Doyle

Edward Brian Fletcher

Isao Kawata

Yuto Ito

Marlon Edward Menezes

James P De Young

Gary F Doyle

A photocurable composition can comprise a polymerizable material, at least one non-reactive polymer, and a photoinitiator, wherein the non-reactive polymer can have a carbon content of at least 80% based on the total weight of the non-reactive polymer; a molecular weight of the at least one non-reactive polymer can be at least 750 g/mol and not greater than 20,000 g/mol; an amount of the non-reactive polymer may be at least 10 wt % and not greater than 30 wt %; and a viscosity of the photocurable composition may be not greater than 110 mPa·s. The photocurable composition may have a low linear shrinkage after curing, a high carbon content and high etch resistance and being suitable for AIP or NIL processing.

Photocurable composition including a non-reactive polymer

A curable composition containing a polymerizable compound (a), a photopolymerization initiator (b), and a solvent (c), wherein the curable composition has viscosity of not less than 2 mPa·s and not more than 60 mPa·s at 23° C., a content of the solvent (d) with respect to the whole curable composition is not less than 5 vol % and not more than 95 vol %, a boiling point of the solvent (d) at normal pressure is less than 250° C., and the polymerizable compound (a) contains a compound (a-1) containing not less than one aromatic ring or aromatic heterocycle, and not less than four vinyl groups directly bonding to the aromatic ring or the aromatic heterocycle.

Curable composition, film forming method and article manufacturing method

A photocurable composition can comprise a polymerizable material, and a photoinitiator, wherein the polymerizable material can comprise at least one polymerizable monomer and at least one reactive polymer. The reactive polymer can have a carbon content of at least 75% based on the total weight of the reactive polymer; a molecular weight of the at least one reactive polymer can be at least 400 g/mol and not greater than 50,000 g/mol; an amount of the reactive polymer may be at least 5 wt %; and a viscosity of the photocurable composition may be not greater than 100 mPa s. The photocurable composition may have a low linear shrinkage after curing, a high carbon content and high etch resistance and being suitable for AIP or NIL processing.

Photocurable composition including a reactive polymer

An object is to provide a photo-curable composition having high dry etching resistance and high thermal stability. A photo-curable composition includes at least a polymerizable compound and a photopolymerization initiator, and further includes at least one of a flame retarder and a flame-retardant polymerizable compound.

Photo-curable composition and methods for preparing cured film, optical component, circuit substrate, electrical component and replica mold using the same

A superstrate can comprise a superstrate blank and a coating overlying an outer surface of the superstrate blank. The superstrate blank can comprises a central region and a tapered edge region, wherein the tapered edge region has an average taper angle of not greater than 20 degrees relative to a length direction of the superstrate blank. In one embodiment, the coating of the superstrate can be applied by spin coating and may have an edge bead below a plane of the coating surface within the central region.

Superstrate and method of making it

A photocurable composition can comprise a polymerizable material, an organic ionic compound and a photoinitiator, wherein an amount of the organic ionic compound may be not greater than 1.5 wt %, the organic ionic compound comprises an organic cation, and a conductivity of the photocurable composition can be at least 20 μS/cm. The photocurable composition can have an improved drop spreading and merging of drops in comparison to the same composition but not including the organic ionic compound.

Photocurable composition comprising an organic ionic compound

A photocurable composition can comprise a polymerizable material, a fullerene or fullerene derivative in an amount of at least 0.2 wt % and not greater than 5.0 wt %, and a photoinitiator and may be adapted for AIP or NIL processing. A photo-cured layer made from the photocurable composition can have an improved thermal stability in comparison to a photo-cured layer made from the same photocurable composition except not containing a fullerene or fullerene derivative.

Photocurable composition comprising a fullerene

A photocurable composition can comprise a polymerizable material and at least one photoinitiator, wherein the polymerizable material comprises a multi-functional vinylbenzene monomer in an amount of at least 30 wt % based on the total weight of the polymerizable material and the at least one photoinitiator includes an oxime ester compound. The photocurable composition can be adapted that a UV shrinkage after forming a photo-cured layer at 23° C. is not greater than 4.0%; and that a thermal shrinkage after conducting a baking treatment of the photo-cured layer at 350° C. is not greater than 3.5%.

Photocurable composition

A curable composition can comprise a polymerizable material including a monomer of Formula (1), with R being H or alkyl or alkylaryl, n being 1-4, m being 0-6, Xbeing C-Csubstituted or unsubstituted alkyl, Xbeing CHor H, After forming a cured layer of the curable composition, the cured layer can have an excellent etch resistance.

Curable composition

A photocurable composition can comprise a polymerizable material and a photoinitiator, wherein the polymerizable material may comprise at least one first polymerizable monomer having a structure of Formula (1): (R)—Ar—(R)(1), with Ar being one or more substituted or unsubstituted aromatic rings; Rbeing a structure covalently bonded to Ar including at least one acrylate group; x being 1-4; and Rbeing —CH═CHor —CCH=CHcovalently bonded to Ar; y being 1-4.

Photocurable composition with enhanced thermal stability

An object is to provide a photo-curable composition having high dry etching resistance and high thermal stability. A photo-curable composition includes at least a polymerizable compound (A) and a photopolymerization initiator (B), and further includes at least one of a flame retarder (E) and a flame-retardant polymerizable compound (F).

In one embodiment, a photocurable composition can comprise a polymerizable material and a photoinitiator, wherein the polymerizable material includes an isocyanate group containing compound of formula (1): R1-R2-N&#x2550;C&#x2550;O (1), with R1 including a carbon-carbon double bond, and R2 being substituted or unsubstituted alkyl, aryl, or alkylaryl. An amount of 1 wt % to 10 wt % of the isocyanate group containing compound can cause a strong adhesion strength of the photocurable composition to a silicon substrate after curing, and may allow the omission of an adhesion layer between substrate and the photo-cured layer.

A photocurable composition can comprise a polymerizable material and a photoinitiator, wherein the polymerizable material can comprise at least one acrylate monomer including at least one cyano group (CN-acrylate monomer). The presence of a low amount of the CN-acrylate monomer between 10 wt % and not greater than 30 wt % can lower the contact angle of the composition and may improve the etch resistance of a photo-cured layer made from the photocurable composition.

Photocurable composition for making layers with high etch resistance

A curable composition comprises at least 10 wt % expanding monomers based on a total weight of the curable composition, at least 25 wt % acrylate monomers based on the total weight of the curable composition, a photoinitiator, and a photosensitizer. The acrylate monomers have a molecular weight of 500 or less. The curable composition has a viscosity of 10 cP or less. A total amount of the expanding monomers and the acrylate monomers are at least 90 wt % based on the total weight of the curable composition.

Curable composition for nano-fabrication

A curable composition can comprise a polymerizable material and a photo-initiator, wherein the polymerizable material can comprise a first monomer including at least one bismaleimide-monomer and at least one second monomer. The curable composition can have a viscosity of not greater than 30 mPa&#xb7;s, and a cured layer of the curable composition can have a high thermal stability up to 350&#xb0; C.

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Austin, TX, United States of America

Fen Wan