Taiwan Semiconductor Manufacturing Comp. Ltd.

Silicon Storage Technology, Inc.

Felix Ying-Kit Tsui

Hau-Yan Lu

Chun-Yao Ko

Hsin-Li Cheng

Shih-Hsien Chen

Wen-Shun Lo

Yu-Chi Chang

Alexander Kalnitsky

Jyun-Ying Lin

Jui-Cheng Huang

Yi-Shao Liu

Tung-Tsun Chen

Jing-Hwang Yang

Shih-Fen Huang

Hsiao-Chin Tuan

Yung-Chow Peng

Chin-Hua Wen

Chien-Li Kuo

Ting-Chen Hsu

Chewn-Pu Jou

Stefan Rusu

Chih-Tsung Shih

Liang-Tai Kuo

Shu-Hui Su

Chien-Kuo Yang

Ta-Chuan Liao

Shi-Min Wu

Tuo-Hsin Chien

Dana Lee

Lan-Chou Cho

Huang-Wen Tseng

Wen-Juei Lu

Chan-Ching Lin

Hsueh-Liang Chou

Feng Yuan

Alex Kalnitsky

Chun-Heng Liao

Yen-Wen Chen

Jing-hwang Yang

A memory device is disclosed. The memory device includes: a first memory cell, including: a first transistor; a second transistor; and a first capacitor; a second memory cell, including: a third transistor; a fourth transistor; and a second capacitor; a third memory cell, including: a fifth transistor; a sixth transistor; and a third capacitor; and a fourth memory cell, including: a seventh transistor; an eighth transistor; and a fourth capacitor; wherein an electrode of the first capacitor, an electrode of the second capacitor, an electrode of the third capacitor, and an electrode of the fourth capacitor are electrically connected to a conductor. An associated manufacturing method is also disclosed.

Memory device and method of manufacturing the same

A semiconductor structure includes a first well region disposed within a substrate and comprising a first doping type. A conductive structure overlies the first well region. A pair of first doped regions is disposed within the first well region on opposing sides of the conductive structure. The pair of first doped regions comprise a second doping type opposite the first doping type. A pair of second doped regions is disposed within the first well region on the opposing sides of the conductive structure. The pair of second doped regions comprise the second doping type and are laterally offset from the pair of first doped regions by a non-zero distance.

Non-volatile memory (NVM) cell structure to increase reliability

In some embodiments, a photodetector is provided. The photodetector includes a first well having a first doping type disposed in a semiconductor substrate. A second well having a second doping type opposite the first doping type is disposed in the semiconductor substrate on a side of the first well. A first doped buried region having the second doping type is disposed in the semiconductor substrate, where the first doped buried region extends laterally through the semiconductor substrate beneath the first well and the second well. A second doped buried region having the second doping type is disposed in the semiconductor substrate and vertically between the first doped buried region and the first well, where the second doped buried region contacts the first well such that a photodetector p-n junction exists along the second doped buried region and the first well.

Image sensor with improved timing resolution and photon detection probability

A capacitor structure and method of forming the capacitor structure is provided, including a providing a doped region of a substrate having a two-dimensional trench array with a plurality of segments defined therein. Each of the plurality of segments has an array of a plurality of recesses extending along the substrate, where the plurality of segments are rotationally symmetric about a center of the two-dimensional trench array. A first conducting layer is presented over the surface and a bottom and sidewalls of the recesses and is insulated from the substrate by a first dielectric layer. A second conducting layer is presented over the first conducting layer and is insulated by a second dielectric layer. First and second contacts respectively connect to an exposed top surface of the first conducting layer and second conducting layer. A third contact connects to the substrate within a local region to the capacitor structure.

Low warpage high density trench capacitor

Various embodiments of the present disclosure are directed towards an integrated chip including a capacitor over a substrate. The capacitor includes a plurality of conductive layers and a plurality of dielectric layers. The plurality of conductive layers and dielectric layers define a base structure and a first protrusion structure extending downward from the base structure towards a bottom surface of the substrate. The first protrusion structure comprises one or more surfaces defining a first cavity. A top of the first cavity is disposed below the base structure.

Trench capacitor profile to decrease substrate warpage

Disclosed are apparatus and methods for optical coupling. In one example, a method for forming an optical coupler, includes: forming an insulation layer on a semiconductor substrate; epitaxially growing a semiconductor material on the insulation layer to form a semiconductor layer; etching, according to a predetermined pattern, the semiconductor layer to form: an array of etched holes in the semiconductor layer to form a grating region, a first taper structure extending from a first side of the grating region, wherein a shape of the first taper structure in the semiconductor layer is a first triangle that is asymmetric about any line perpendicular to the first side of the grating region, and a second taper structure extending from a second side of the grating region, wherein a shape of the second taper structure in the semiconductor layer is a second triangle that is asymmetric about any line perpendicular to the second side of the grating region, wherein the first side and the second side are substantially perpendicular to each other; and depositing a dielectric material into the array of etched regions to form an array of scattering elements in the semiconductor layer, wherein the scattering elements are arranged to form a two-dimensional (2D) grating.

Two-dimensional grating coupler and methods of making same

A structure includes a first waveguide and a second waveguide. The first waveguide includes a first strip portion and a first tapered tip portion connected to the first strip portion. The second waveguide includes a second strip portion and a second tapered tip portion connected to the second strip portion, wherein the first tapered tip portion of the first waveguide is optically coupled to the second tapered tip portion of the second waveguide, and the first waveguide and the second waveguide are configured to guide a light. In a region where the light is coupled between the first tapered tip portion and the second tapered tip portion, an effective refractive index of the first waveguide with respect to the light is substantially equal to an effective refractive index of the second waveguide with respect to the light.

Optical waveguide coupler

Various embodiments of the present disclosure are directed towards an integrated chip including a first well region and a second well region disposed within a substrate. A gate electrode overlies the first well region and the second well region. A first memory active region is disposed within the second well region. A second memory active region is disposed within the second well region and is laterally offset from the first memory active region by a non-zero distance.

A biological device includes a substrate, a gate electrode, and a sensing well. The substrate includes a source region, a drain region, a channel region, a body region, and a sensing region. The channel region is disposed between the source region and the drain region. The sensing region is at least disposed between the channel region and the body region. The gate electrode is at least disposed on or above the channel region of the substrate. The sensing well is at least disposed adjacent to the sensing region.

Biological device and biosensing method thereof

Various embodiments of the present disclosure are directed towards an integrated circuit (IC) including a substrate comprising sidewalls that define a trench. A capacitor comprising a plurality of conductive layers and a plurality of dielectric layers that define a trench segment is disposed within the trench. A width of the trench segment continuously increases from a front-side surface of the substrate in a direction towards a bottom surface of the trench.

Disclosed are apparatus and methods for optical coupling. In one example, a described apparatus includes: a planar layer; a grating region comprising an array of scattering elements arranged in the planar layer to form a two-dimensional grating; a first taper structure formed in the planar layer connecting a first side of the grating region to a first waveguide, wherein a shape of the first taper structure is a first triangle that is asymmetric about any line perpendicular to the first side of the grating region in the planar layer; and a second taper structure formed in the planar layer connecting a second side of the grating region to a second waveguide, wherein a shape of the second taper structure is a second triangle that is asymmetric about any line perpendicular to the second side of the grating region in the planar layer, wherein the first side and the second side are substantially perpendicular to each other.

An integrated circuit includes two or more rows of heating elements, two or more columns of heating elements, and a plurality of sensing areas. Each sensing area is between two adjacent rows of the rows of heating elements and between two adjacent columns of the columns of heating elements and includes a bio-sensing device and a temperature-sensing device.

Bio-sensing and temperature-sensing integrated circuit

The present disclosure provides a semiconductor device package. The semiconductor device package includes a semiconductor substrate having a first surface and a first optical coupler disposed on the first surface of the semiconductor substrate. The first optical coupler includes a first surface facing away from the first surface of the semiconductor substrate and a first lateral surface connected to the first surface of the first optical coupler. The first surface of the first optical coupler and the first lateral surface of the optical coupler define an angle greater than 90 degrees. A method of manufacturing a semiconductor device package is also disclosed.

Growing community of inventors

Cupertino, CA, United States of America

Felix Ying-Kit Tsui