Institut Fur Mikrotechnik Mainz Gmbh

Fraunhofer-gesellschaft Zur Foerderung Der Angewandten Forschung E.v.

Felix Schmitz

Matthias Nienhaus

Wolfgang Ehrfeld

Rainer Gransee

Eva Schaeffer

Klaus-Stefan Drese

Tobias Baier

Udo Berg

Silvio Kraus

Marc Begemann

Yannick Ansel

Manfred Lacher

A microvalve for controlling fluid flows, and a sealing device for sealing cavities in a microfluidic system, particularly in a lab-on-a-chip system, and a method for the production thereof. A sealing surface of a valve body, or a sealing element, respectively, rests on a sealing surface of a substrate and is pressed against the sealing surface of the substrate in a fluid-tight manner by means of a clamping element. The clamping element and/or the valve body, or the sealing element, respectively, are at least partially elastic.

Microvalve and sealing device for use in a microfluidics system, and method for the production thereof

The invention relates to an assembly device for microcomponents that are disposed in a magazine. The inventive assembly device does not require any optical systems and allows for an exact positioning of the microcomponents. The assembly will also be unaffected by any position changes of the microcomponents caused by wastage. The assembly device is provided with mechanical alignment devices that engage with or act upon adjustment structures of the magazine. The assembly device further comprises clamping devices for fixing the magazine and at least one plunger for ejecting at least one microcomponent from the magazine. An assembly platform is provided in the upper tool or in the lower tool of the assembly device and receives the microcomponents in a defined position. The invention further relates to a method for assembling microcomponents and to a corresponding magazine.

Magazine, assembly device for microcomponents

The invention relates to a flat coil and to a lthographic method for producing microcomponents with metal component sources in the sub-millimeter range. According to the inventive method, a resist material is structured by means of selective exposition and removing the unexposed zones and filling in the gaps between the resist structures with metal by means of a galvanic method to produe the metal component structures. The aim of the invention is to improve such a method so that the microcomponents can be subdivided during said process. To this end, a structured three-dimensional sacrificial metal layer is produced during the production of the microcomponent, said sacrificial layer delimiting the microcomponent and being removed once the microcomponent is due to be subdivided. The invention also relates to a method for producing microcomponents with component structures of cross-linkable resist material and to a flat coil for micromotors with at least one coil layer with strip conductors in the sub-millimeter range.

Flat coil and lithographic method for producing microcomponents

The invention relates to a lithographic method for producing microcomponents with component structures in the submillimeter range. According to the inventive method, a structured adhesive layer is applied to a metal layer and then a photostructured epoxy resin layer is applied to said adhesive layer. Said epoxide resin is structured by means of selective exposition and removing the unexposed zones and filling in the gaps between the resin structures with metal by electroplating. The aim of the invention is to provide an adhesive layer that is suitable for photostructured epoxy resins, especially for SU-8 resist material and that prevents the resist material from being detached. To this end, the adhesive layer consists of polyimide or a polyimide mixture.

Use of polyimide for adhesive layers, lithographic method for producing microcomponents and method for producing composite material

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Mainz, Germany

Felix Schmitz