Lockheed Martin Energy Research Corporation

Lambda Technologies, Inc.

Martin Marietta Energy Systems, Inc.

Lockheed Martin Energy Systems, Inc.

Felix L Paulauskas

Robert J Lauf

Zakaryae Fathi

Jianghua Wei

April D McMillan

Thomas T Meek

Don W Bible

Methods of facilitating the adhesive bonding of various components with variable frequency microwave energy are disclosed. The time required to cure a polymeric adhesive is decreased by placing components to be bonded via the adhesive in a microwave heating apparatus having a multimode cavity and irradiated with microwaves of varying frequencies. Methods of uniformly heating various articles having conductive fibers disposed therein are provided. Microwave energy may be selectively oriented to enter an edge portion of an article having conductive fibers therein. An edge portion of an article having conductive fibers therein may be selectively shielded from microwave energy.

Adhesive bonding using variable frequency microwave energy

A method for curing polymers (11) incorporating a variable frequency microwave furnace system (10) designed to allow modulation of the frequency of the microwaves introduced into a furnace cavity (34). By varying the frequency of the microwave signal, non-uniformities within the cavity (34) are minimized, thereby achieving a more uniform cure throughout the workpiece (36). A directional coupler (24) is provided for detecting the direction of a signal and further directing the signal depending on the detected direction. A first power meter (30) is provided for measuring the power delivered to the microwave furnace (32). A second power meter (26) detects the magnitude of reflected power. The furnace cavity (34) may be adapted to be used to cure materials defining a continuous sheet or which require compressive forces during curing.

Method for curing polymers using variable-frequency microwave heating

A method for joining two or more items having surfaces of thermoplastic material includes the steps of depositing an electrically-conductive material upon the thermoplastic surface of at least one of the items, and then placing the other of the two items adjacent the one item so that the deposited material is in intimate contact with the surfaces of both the one and the other items. The deposited material and the thermoplastic surfaces contacted thereby are then exposed to microwave radiation so that the thermoplastic surfaces in contact with the deposited material melt, and then pressure is applied to the two items so that the melted thermoplastic surfaces fuse to one another. Upon discontinuance of the exposure to the microwave energy, and after permitting the thermoplastic surfaces to cool from the melted condition, the two items are joined together by the fused thermoplastic surfaces. The deposited material has a thickness which is preferably no greater than a skin depth, .delta..sub.s, which is related to the frequency of the microwave radiation and characteristics of the deposited material in accordance with an equation.

Joining of thermoplastic substrates by microwaves

Growing community of inventors

Oak Ridge, TN, United States of America

Felix L Paulauskas