Ddp Specialty Electronic Materials US, LLC

Dow Global Technolgoies LLC

Felix Koch

Andreas Lutz

Gary Lee Jialanella

Stefan Schmatloch

Daniel Schneider

Bindu Krishnan

Sergio Grunder

Tyler Auvil

Eric E Cole

Joel Kunz

Cathy Grossnickel

Jeannine Flueckiger

Beda Steiner

Cody Clinton

Grunder Sergio

Gary L Jialanflla

An epoxy-based crash durable adhesive composition including: (I) a liquid resin system comprising: (a) at least one epoxy resin; and (b) at least one toughener; wherein the viscosity of the above liquid resin system is less than about 800 Pa s at a temperature of 15&#xb0; C.; and wherein the viscosity of the above liquid resin system is greater than about 5 Pa-s at a temperature of 60&#xb0; C.; (II) a solid material comprising: (c) at least one hydrophobic fumed silica, wherein the fumed silica is present in the adhesive composition at a concentration of greater than 5 weight percent; and (III) a curative material comprising: (d) at least one latent heat-activated curing agent; wherein the rheology of the epoxy-based crash durable adhesive composition is such that the adhesive composition is pumpable at a temperature of 15&#xb0; C. or greater; and wherein the epoxy-based crash durable adhesive composition exhibits an increase in wash-off resistance; a process for making the above adhesive composition; and a process for bonding metal substrates together with the above adhesive composition.

Adhesive composition

Disclosed are one-component epoxy resin adhesive compositions which include (a) one or more non-rubber-modified epoxy resins; (b) one or more latent epoxy curing agents; (c) one or more toughening agents; and (d) zinc oxide nanoparticles. The one-component epoxy resin adhesive compositions exhibit improved toughness of the adhesive as measured by its lap shear strength as well as improved environmental stability, i.e., corrosion protection, by addition of the zinc oxide nanoparticles when applied to metal substrates.

Epoxy resin adhesive compositions

A one-component toughened epoxy-modified polyurethane and/or urea adhesive includes a mixture of dicyandiamide and a dihdyrazide as curing agents. The mixture of curing agents permits the adhesive to be cured at lower temperatures while developing good adhesive and mechanical properties in the cured adhesive.

One-component toughened epoxy adhesives containing a mixture of latent curing agents

Disclosed are latent two-part polyurethane adhesives that rapidly develop adhesive strength when cured by application of infrared radiation containing a polyol component which includes; one or more polyols having a hydroxyl equivalent weight of 400 to 2000 and a nominal hydroxyl functionality of 2 to 3; one or more aliphatic diol chain extenders; one or more latent room temperature organometallic catalysts; and one or more multifunctional polyols having a functionality of greater than 3; b) a polyisocyanate component containing one or more polyisocyanate compounds; and v) a carboxylic acid-blocked cyclic amidine compound, vi) a phenol-blocked cyclic amidine compound or both of v) one or more carboxylic acid-blocked cyclic amidine compounds and vi) one or more phenol-blocked cyclic amidine compounds which may be located in the polyol component or the isocyanate component. Further disclosed are methods of bonding structures together using the latent two-part polyurethane adhesives.

Latent two-part polyurethane adhesives curable with infrared radiation

Growing community of inventors

Horgen, Switzerland

Felix Koch