Rohm & Haas Electronic Materials LLC

Rohm and Haas Electronics LLC

Felix J Schwager

Edit Szocs

Michael P Toben

Nathaniel E Brese

Thomas Gaethke

Martin William Bayes

Wan Zhang-Beglinger

Margit Clauss

Jonas Guebey

A high speed method of depositing palladium and palladium alloys is disclosed. The high speed method uses an aqueous, ammonia-based bath which has reduced free ammonia in the bath. The high speed method may be used to deposit palladium and palladium alloy coatings on various substrates such as electrical devices and jewelry.

High speed method for plating palladium and palladium alloys

Electrochemically deposited indium composites are disclosed. The indium composites include indium metal or an alloy of indium with one or more ceramic materials. The indium composites have high bulk thermal conductivities. Articles containing the indium composites also are disclosed.

Electrochemically deposited indium composites

Indium compositions including hydrogen suppressor compounds and methods of electrochemically depositing indium metal from the compositions onto substrates are disclosed. Articles made with the indium compositions are also disclosed.

Indium compositions

Methods of replenishing indium ions in indium electroplating compositions are disclosed. Indium ions are replenished during electroplating using indium salts of certain weak acids. The method may be used with soluble and insoluble anodes.

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Meggen, Switzerland

Felix J Schwager