Infineon Technologies Austria Ag

Felix Grawert

Ralf Otremba

Uwe Kirchner

Teck Sim Lee

Bernd Schmoelzer

Franz Stueckler

Fabian Schnoy

Amirul Afiq Hud

Edward Fuergut

Uwe Wahl

Andreas Schloegl

Guenther Lohmann

Ernst Katzmaier

Ulrich Froehler

Rene Mente

Hwee Yin Low

A device may include a carrier, a semiconductor chip arranged over a first surface of the carrier, and an encapsulation body comprising six side surfaces and encapsulating the semiconductor chip. A second surface of the carrier opposite to the first surface of the carrier is exposed from the encapsulation body. The device may further include electrical contact elements electrically coupled to the semiconductor chip and protruding out of the encapsulation body exclusively through two opposing side surfaces of the encapsulation body which have the smallest surface areas of all the side surfaces of the encapsulation body, and an electrically insulating layer arranged over the exposed second surface of the carrier.

Semiconductor devices with improved thermal and electrical performance

The semiconductor chip package comprises a semiconductor chip, and an encapsulation body encapsulating the semiconductor chip, wherein the encapsulation body comprises a semiconductor chip; an encapsulation body encapsulating the semiconductor chip, wherein the encapsulation body comprises two opposing main faces and side faces which connect the two main faces with each other, wherein the side face have a smaller surface area than the main faces, respectively, and wherein a marking is provided on at least one of the side faces.

Semiconductor chip package comprising side wall marking

Various embodiments provide an electronic device, wherein the electronic device comprises a mounting surface configured to mount the electronic device to an external structure and having a first size; a backside electrode having a second size and having arranged thereon a die electrically connected to the backside electrode; wherein the first size is at least three times the second size.

Electronic device and method of manufacturing the same

Growing community of inventors

Villach, Austria

Felix Grawert