Amazon Technologies, Inc.

Felipe A Varela

Adrian Napoles

Marc Rene Walliser

Bernhard Wildner

Jonathan Howard Biddle

Sun Joo Han

Sarah Graber

Albert John Yu Sam Chua

Ulf Jan-Ove Mattsson

Brad Nathaniel Arnold

Anuj Dron

Eswarappa Channabasappa

Miguel Angel Morales

Michael Xingyi Yu

Kelly Erin Johnson

Angel Wilfredo Martinez

Brandon Michael Potens

Srivatsan Subbarayan

Michael Christopher Kouxommone

Mandar Nilkanth Kulkarni

Ge PengJin

Robert Cong Liang

Marc Anthony Zampino

Mark Novak

Electronic device charger

Electronic device

Ring-shaped electronic device

Systems, methods, and computer-readable media are disclosed for ring-shaped devices with voice integration. In one embodiment, an example device may include an antenna element that at least partially forms an outer surface of the ring-shaped device, an outer shell coupled to the antenna element, an inner shell coupled to the outer shell, a curved battery disposed along a first side of the ring-shaped device, and a flexible printed circuit assembly coupled to the curved battery and disposed along a second side of the ring shaped device.

Ring-shaped devices with voice integration

An apparatus includes a radio frequency (RF) feed and an extruded member made of metal and coupled to the RF feed. The extruded member includes a first surface that includes a first slot having a first width and a first length, and a second slot having a second width and a second length. The second width is at least 1.2 times greater than the first width. The second slot intersects the first slot at an angle with respect to the first slot that is between 70 and 110 degrees.

Antenna design for full duplex communication with multiple wireless communication protocol coexistence

A housing for an electronic device includes a single rear housing assembly coupled to the cover glass of a display assembly. The rear housing assembly includes a metal rear chassis with two layers of injection molded material formed on at least the chassis side regions. The first injection molded layer includes a high reinforcing agent content percentage to provide increased stiffness, and the second injection molded layer includes a low reinforcing agent content percentage, which provides less structural support than the first injection molded layer, but an improved aesthetic appearance.

Multi-layer injection molded device housings

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San Jose, CA, United States of America

Felipe A Varela