Google Inc.

Feini Zhang

Madhusudan K Iyengar

Jorge Padilla

Padam Jain

Connor Burgess

Yuan Li

Yuan Hang Li

Emad Samadiani

Reza H Khiabani

Systems and methods for using spring force based compliance to minimize the bypass liquid flow gaps between the tops of chip microfins and bottom side of manifold ports are disclosed herein. A fluid delivery and exhaust manifold structure provides direct liquid cooling of a module. The manifold sits on top of a chip with flow channels. Inlet and outlet channels of the manifold in contact with flow channels of the chip creates an intricate crossflow path for the coolant resulting in improved heat transfer between the chip and the working fluid. The module is also designed with pressure reduction features using internal leakage flow openings to account for pressure differential between fluid entering and being expelled from the module.

Spring loaded compliant coolant distribution manifold for direct liquid cooled modules

Systems and methods for utilizing the dead space around the periphery of a chip for sealing a direct liquid cooled module are disclosed. One of the functions of a direct liquid cooled module is to provide cooling liquid to components located on a chip. A groove member for receiving a sealing member may be applied to the top surface of the chip. The groove member may be directly deposited to the top surface or coupled thereto via an adhesive and/or epoxy. The groove member may be in the form of opposing sidewalls or a u-shaped structure each of which form a partial enclosure for receipt of the sealing member. The groove member may be located entirely within the dead space or at least partially within the dead space and partially within a central area in which the chip components are located. The sealing member may be an O-ring or a gasket.

Direct liquid cooling with O-ring sealing

A system includes a central supply line and a central return line connected to a fluid source of cooling liquid. A rack supply manifold is connected to the central supply line. A rack return manifold is connected to the central return line. A liquid cooling loop assembly may be coupled to at least one cooling device connected to a circuit board. Multiple inlet connectors may be connected to the rack supply manifold. Multiple outlet connectors may be connected to the rack return manifold. The multiple inlet connectors provide a passageway for the cooling liquid from the central supply line into the liquid cooling loop assembly for distribution to the at least one cooling device. The multiple outlet connectors provide a passageway to the rack return manifold for the cooling liquid exiting the at least one cooling device.

Multiple supply and return connections for liquid cooling loop assemblies

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Sunnyvale, CA, United States of America

Feini Zhang