Memsic, Inc.

Feiming Huang

Yang Zhao

Haidong Liu

Zongya Li

Devices for providing tri-axial measurements in an x-direction, a y-direction, and a z-direction and methods of their manufacture are disclosed. The devices comprise a leadframe, at least one X- and Y-axis sensor die, at least one integrated circuit, and a Z-axis sensor. The Z-axis sensor is encapsulated in a pre-molding before the leadframe, X- and Y-axis sensor die(s), integrated circuit(s), and the pre-molding are encapsulated to provide a final molding.

Three-dimensional multi-chips and tri-axial sensors and methods of manufacturing the same

A system and method for testing and calibrating integrated sensor devices that improves the manufacturing test throughput of the devices. The system includes a tester, a temperature controller, and at least one probe station including a thermal chuck. The chuck can be heated to specified temperatures to achieve variable heating of a wafer, PCB, or pallet disposed thereon. The temperature controller adjusts the temperature of the chuck to a first specified level. The tester performs at least one first measurement of the output offset of each integrated sensor embodied as a die on the wafer, or as a device on the PCB or pallet. Next, the temperature controller adjusts the temperature of the chuck to a second specified level, and the tester performs at least one second measurement of the output offset of each integrated sensor at the second temperature level. The offset temperature coefficient (OTC) of each sensor is calculated based upon the output offset measurements performed at the first and second temperature levels, and optimal settings for calibrating the respective sensors are determined based upon the calculated OTC values. After the temperature of the chuck is brought back down to the first specified level, the tester programs the output offset calibration settings into each sensor.

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Wuxi, China

Feiming Huang