Shanghai Micro Electronics Equipment (group) Co., Ltd.

Shanghai Micro Electronics Equipment Co., Ltd.

Feibiao Chen

Hai Xia

Song Guo

Yuebin Zhu

Xiaoyu Jiang

Jingchao Qi

Tianming Wang

Qi Cheng

Yaping Ge

Bin Yu

Lili Zhao

Chang Jin Zhou

Jianqi Sun

Yuefei Chen

Hailin Cheng

Haijun Song

Donghao Zhang

Xuting Wu

Lei Diao

Kan Lu

A semiconductor manufacturing apparatus, including a chip supply module used for providing a plurality of chips; a load plate supply module including a load plate and a load-plate motion platform used for holding the load plate; a chip transfer-loading module including a chip transfer-loading platform used for suctioning chips. The chip transfer-loading platform is used at a first position for transferring chips from the chip supply module. The chip transfer-loading platform carries the chips to a second position to bond the chips onto a load plate to form a bonding sheet. A packaging module is used for packaging the bonding plate on the load-plate motion platform to form a packaged chip.

Semiconductor manufacturing apparatus

A chip bonding apparatus includes a chip separation unit, a chip alignment unit, a chip bonding unit and a bonding robotic arm unit. The bonding robotic arm unit includes a first bonding robotic arm unit and a second bonding robotic arm unit. The first bonding robotic arm unit includes a first motion stage, a first driver configured to drive the first motion stage and at least one first bonding robotic arm arranged on the first motion stage. The first bonding robotic arm is configured to suck up a chip from the chip separation unit and deliver it to the chip alignment unit. The second bonding robotic arm unit includes a second motion stage, a second driver configured to drive the second motion stage and at least one second bonding robotic arm arranged on the second motion stage.

Chip bonding device

A chip bonding apparatus and method are disclosed. The chip bonding apparatus includes: at least one separation module for separating chips; at least one bonding module for bonding the chips a substrate; a transportation device for transporting the chips between the separation module and the bonding module, the transportation device including one or more guide tracks and one or more transportation carriers for retaining the chips, each of the guide tracks is provided thereon with at least one of the transportation carriers; and a control device for individually controlling the separation module, the bonding module and the transportation device. The chip bonding apparatus and method allows pickup, transportation and chip-to-substrate bonding of chips in batches with increased chip bonding yield and improved chip bonding accuracy.

Chip bonding device and bonding method thereof

A flip-chip bonding device and method are disclosed. The bonding device includes: a supply unit () for separating a flip-chip () from a carrier () and providing the flip-chip (), the supply unit () including flipping device (); a transfer unit () for receiving the flip-chip () from the flipping device (); a position adjustment unit () for adjusting the positions of flip-chips () on the transfer unit (); a bonding unit () for bonding the flip-chips () on the transfer unit () onto a substrate (); a transportation unit () for transporting the transfer unit (); and a control unit () for controlling the movement of the preceding units. The transfer unit () is capable of receiving multiple flip-chips () and allows the flip-chips () to be bonded simultaneously. This can result in savings in bonding time and an improvement in throughput. Moreover, during the transportation of the transfer unit (), the positions of the flip-chips () thereon can be adjusted by the position adjustment unit (), thereby ensuring high positional accuracy of the flip-chips () in the subsequent bonding step. As a result, a high-accuracy bonding can be achieved.

Flip chip bonding device and bonding method

A universal chip batch-bonding apparatus and method. The apparatus comprises a material pick-and-place area and a transfer work area. The material pick-and-place area comprises a blue tape pick-and-place area () for providing a chip () and a substrate pick-and-place area () for placing a substrate (), the blue tape pick-and-place area () and the substrate pick-and-place area () being separately arranged at two ends of the transfer work area. The transfer work area sequentially comprises a chip pickup and separation area (), a chip alignment and fine-tuning area (), and a chip batch-bonding area () in a direction running from the blue tape pick-and-place area () to the substrate pick-and-place area (). A chip carrier transfer apparatus () is provided in the transfer work area, and the chip carrier transfer apparatus () passes through the transfer work area and is used to move and supply materials among the chip pickup and separation area (), the chip alignment and fine-tuning area (), and the chip batch-bonding area (). By means of a compatible design, the apparatus is suitable for both die-up and die-down attachment modes, expanding the application scope of the apparatus. In addition, the modular design can be configured according to requirements, increasing market potential.

Universal chip batch-bonding apparatus and method

A batch bonding apparatus and bonding method. The bonding apparatus comprises: a chip supply unit () for providing a chip () to be bonded; a substrate supply unit () for providing a substrate; a transfer unit () for transferring the chip () between the chip supply unit () and the substrate supply unit (); and a pickup unit () disposed above the chip supply unit (), for picking up the chip () from the chip supply unit () and uploading the chip () to the transfer unit () after flipping a marked surface of the chip () in a required direction. In the present invention pickup of each chip is completed individually, but transfer processes and bonding processes can be carried out for multiple chips at the same time, greatly increasing yield.

Batch bonding apparatus and bonding method

A chip bonding device is disclosed, including a first motion stage (), a second motion stage (), a chip pickup element (), a transfer carrier (), a chip adjustment system (), a bonding stage () and a control system (). A chip bonding method is also disclosed, in which a set of chips are temporarily retained on the transfer carrier () and their positions on the transfer carrier () are accurately adjusted by using the chip adjustment system (), followed by bonding the chips on the transfer carrier () simultaneously onto the substrate (). With this batch bonding approach, flip-chips can be bonded with greatly enhanced efficiency. Moreover, picking up and bonding chips in batches can balance times for chip picking up, fine chip position tuning and chip bonding, thereby ensuring high bonding accuracy while increasing the throughput.

Chip bonding apparatus and method

Provided are a chip bonding apparatus and bonding method. The apparatus comprises: a chip supply unit (); a substrate supply unit (); a first pick-up assembly () arranged between the chip supply unit () and the substrate supply unit (), comprising a first rotating component and a first pick-up head arranged on the first rotating component; a second pick-up assembly () comprising a second rotating component and a second pick-up head arranged on the second rotating component, wherein the first pick-up assembly () picks up a chip () from the chip supply unit () or the second pick-up assembly (), and delivers the chip () onto a substrate of the substrate supply unit () to complete the bonding; and a vision unit () for realizing the alignment of the chip () and the substrate on the first pick-up assembly (), wherein the chip supply unit (), the substrate supply unit (), the second pick-up assembly () and the vision unit () are respectively located on four work positions of the first pick-up head. The chip () is transported through rotation, improving the productivity of chip () bonding; and the chip () is reversed by utilizing the second pick-up assembly (), which is compatible with two ways of bonding, i.e. a mark face of the chip () facing upwards and downwards.

Chip bonding apparatus and bonding method

A measurement device and method for focusing and leveling are disclosed. The device includes a measuring optical path and a first monitoring optical path. Measuring light in the measuring optical path interacts with a wafer and is then incident on a measuring detector to form thereon a measuring mark. First monitoring light in the first monitoring optical path is incident on a measuring detector to form thereon a first monitoring mark. An error in a measurement result of the wafer that arises from a drift of the measuring detector can be eliminated by compensating for a vertical deviation of the wafer obtained by subtracting a drift of the first monitoring mark from a displacement of the measuring mark. In this way, measurement accuracy and stability can be improved by monitoring and correcting the drift of the measuring detector.

Focusing and leveling measurement device and method

Disclosed is an adaptive groove focusing and leveling device for measuring the height and the inclination of the surface of a measured object (). The measured object () is provided with cyclic grooves () in the surface and supported by a moving table; the focusing and leveling device sequentially comprises an illumination unit, a projection unit, a detection unit and a detector (); the measured object () is positioned between the projection unit and the detection unit along the light path, the projection unit comprises a projection slit () and is used for forming a plurality of measuring points () on the measured object (), and each measuring point () comprises at least three measuring child light spots (), wherein the at least three measuring child light spots () are arranged at unequal intervals, so that when the plurality of measuring points () are projected to the surface of the measured object (), at least two of the at least three measuring child light spots () of each measuring point () can be positioned outside the grooves (), and then the height and the inclination of the surface of the measured object () are measured.

Adaptive groove focusing and leveling device and method

In an exposure apparatus and a method for defocus and tilt error compensation, each of alignment sensors () corresponds to and has the same coordinate in the first direction as a respective one of focusing sensors (), so that each of the alignment sensors () is arranged on the same straight line as a respective one of the focusing sensors (). As such, alignment marks can be characterized with both focusing information and alignment information. This enables the correction of errors in the alignment information and thus achieves defocus and tilt error compensation, resulting in significant improvements in alignment accuracy and the production yield.

Exposure device and out-of-focus and tilt error compensation method

A focusing and leveling apparatus, including: an illumination light source () for emanating a light beam; an illumination lens group (), a projecting unit, an object () being measured, a detecting unit, a refractive unit, a relay lens group and a photoelectric detector (), disposed sequentially in this order in a transmission path of the light beam. The projecting unit includes projection slits () defining a plurality of non-linearly arranged marks, such that after passing sequentially through the illumination lens group (), the projecting unit, the object () being measured and the detecting unit, the light beam emanated by the illumination light source () becomes a plurality of non-linearly arranged sub-beams corresponding to the plurality of marks. The refractive unit is so configured that after passing through the refractive unit, the plurality of sub-beams form a plurality of linearly arranged light spots.

Growing community of inventors

Shanghai, China

Feibiao Chen