Freescale Semiconductor,inc.

Fei Ying Wong

Wai Wong Chow

Hei Ming Shiu

Man Hon Cheng

Wai Keung Ho

On Lok Chau

Ho Wang Wong

A lead frame () for a semiconductor device includes a first row of terminals () surrounding a die receiving area () and a second row of terminals () spaced from and surrounding the first row of terminals (). The first and second rows of terminals () have a first height (H). The terminals () of the first row include a step () that has a greater height (H). Bond wires () connecting die pads () to the first row terminals () extend over the second height Hpart of the terminal () and are attached to the first height Hpart of the terminal (). The step () insures that the bond wires () attached to the stepped terminals () have a high wire kink profile so that they are less susceptible to damage in later process steps.

Multi-row lead frame

An electronic device () including a first integrated circuit (IC) die () electrically connected to a first lead frame () and a second IC die () electrically connected to a second lead frame (). The first lead frame () is electrically connected to the second lead frame () by at least one stud bump (), which is selectively formed where an electrical connection between the first lead frame () and the second lead frame () is required. The first and second lead frames () and (), the first and second IC dies () and (), and the at least one stud bump () are encapsulated by a mold compound () to form a 3D package.

Three-dimensional package

A leadframe () for a semiconductor device includes a paddle ring () having an inner perimeter (), an outer perimeter (), and a cavity () located within the inner perimeter () for receiving an integrated circuit die (). A first row of terminals () surrounds the outer perimeter () and a second row of terminals () surrounds the first row of terminals (). Each of the terminals of the first row of terminals () is individually connected to the paddle ring () and each of the terminals of the second row of terminals () is connected to one side of a connection bar (), which is connected to one of the terminals of the first row () or to the paddle ring ().

Growing community of inventors

Hong Kong, China

Fei Ying Wong