Shunsin Technology (zhong Shan) Limited

Fei Ren

A manufacturing method for circuit board on copper ceramic substrate comprises stamping a copper sheet into a copper circuit board in a shape matching a ceramic substrate, fitting the copper circuit board to the ceramic substrate and sintering the copper circuit board and the ceramic substrate together by direct bonding copper.

Manufacturing method for circuit board based on copper ceramic substrate

A light-emitting diode chip package and a manufacturing process thereof sequentially includes a transparent layer, a fluorescent layer, a wafer layer, a light-emitting diode chip, a dielectric layer, a metal circuit layer, and a protective film and conductive blocks used to draw out the electrodes of the light-emitting diode chip. The outer surfaces of the fluorescent layer and the wafer layer retreat from the fluorescent layer down to the wafer layer to form a slant, and the dielectric layer, the metal circuit layer, and the protective film spread out to coat the slant. Simple techniques at low cost are involved.

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Shenzhen, China

Fei Ren