Growing community of inventors

Hsinchu County, Taiwan

Fei-Jain Wu

Average Co-Inventor Count = 3.43

ph-index = 1

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 4

Fei-Jain Wu ↔ Chin-Tang Hsieh (2 patents)Fei-Jain Wu ↔ Chia-Jung Tu (2 patents)Fei-Jain Wu ↔ Chih-Ming Kuo (1 patent)Fei-Jain Wu ↔ Lung-Hua Ho (1 patent)Fei-Jain Wu ↔ Chun-Te Lee (1 patent)Fei-Jain Wu ↔ You-Ming Hsu (1 patent)Fei-Jain Wu ↔ Tsang-Sheng Liao (1 patent)Fei-Jain Wu ↔ Ching-Yi Huang (1 patent)Fei-Jain WuFei-Jain Wu (4 patents)Chin-Tang HsiehChin-Tang Hsieh (23 patents)Chia-Jung TuChia-Jung Tu (9 patents)Chih-Ming KuoChih-Ming Kuo (21 patents)Lung-Hua HoLung-Hua Ho (14 patents)Chun-Te LeeChun-Te Lee (12 patents)You-Ming HsuYou-Ming Hsu (10 patents)Tsang-Sheng LiaoTsang-Sheng Liao (1 patent)Ching-Yi HuangChing-Yi Huang (1 patent)
..
Inventor’s number of patents
..
Strength of working relationships

Company Filing History:

1. Chipbond Technology Corporation (4 from 79 patents)


4 patents:

1. 11651974 - Semiconductor package and method of fabricating the same

2. 9961759 - Flexible substrate

3. 9510441 - Flexible substrate

4. 9177830 - Substrate with bump structure and manufacturing method thereof

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