Magnecomp Corporation

Sae Magnetics (h.k.) Limited

Fei He

Li Jun Ma

Atsushi Iijima

Wei Xiong

Huai Yang

HaiMing Zhou

Jianbin Zhang

Hai Ming Zhou

Haiming Zhou

HaiHua Jiang

Haijun Gao

Hai Hua Jiang

A piezoelectric device comprises a pressure chamber forming layer, a vibration plate disposed on and connected with the pressure chamber forming layer to form a pressure chamber, and a piezoelectric element disposed on the vibration plate and used for driving the vibration plate to move and thus changing a volume of the pressure chamber, wherein the piezoelectric element is disposed on the vibration plate in such a manner as to cover a portion of the pressure chamber, the piezoelectric element has two opposite ends respectively extending beyond an edge of the pressure chamber and covering the pressure chamber forming layer. The piezoelectric device of the present invention can efficiently actuate the vibration plate, eliminate undesired displacements of the vibration plate in the opposite direction at the edge of the chamber, and provide higher displacement sensitivity to driving voltage.

Thin-film piezoelectric actuator

A disk drive suspension with a bend-down tab which supports an outrigger lead. The bend-down tab extends laterally to the suspension and away from the slider, and can include tabs which are narrower than the electrical lead. The depth of the tab can be at least the depth of the outrigger lead, or deeper. The tab can be supported by and integrally formed with an elongate gimbal spring arm.

Bend-down tab for outrigger lead support in a disk drive suspension

A method is provided for reclaiming a suspension from a disk drive head gimbal assembly (HGA). An ultrasonic probe is applied to the HGA's read/write head slider on a side opposite that of its solder balls. Ultrasonic oscillations are transmitted through the ceramic slider to the side with the solder balls. The oscillations break the brittle intermetallic compound of the slider balls and free the slider. The ultrasonic energy also weakens the epoxy adhesive between the slider and suspension. The method can be used with heat to further weaken the solder balls and adhesive.

Ultrasonic reclaim method for disk drive suspensions

In a flexure assembly for a hard disk drive suspension, a structure for preventing strains introduced by solder ball bonding from affecting the pitch static attitude (PSA) and other characteristics of the flexure assembly is presented. The structure includes a flexure that features two side rails that support a gimbal tongue, with the side rails also supporting a laterally extending bridge which is attached at its two ends to the side rails. The bridge is wide enough at its central portion to accommodate the flex trace circuit bonding pads, yet narrow enough at its ends to relieve strains caused by solder ball bonding and cooling and prevent those strains from significantly affecting the PSA. The gimbal tongue is thus, to an effective extent, mechanically and thermally isolated from the solder ball bonding pads, while at the same time the bridge provides strong mechanical support for the solder ball bonding pads.

Structure and method for localizing solder ball strain on hard disk drive suspension gimbal

A head arm assembly comprises a slider, a drive arm, a trace; and a load beam having a hinge portion and a slider mounting portion; wherein the slider mounting portion has a slider support portion to support flying attitude of the slider. The slider support portion has a slider mounting frame with a flexible lifter to maintain the slider position in a predetermined position. In the present invention, the flexible lifter has a spring structure. The load beam may further comprise a stiffener formed in a longitudinal direction of the head arm assembly. The invention also discloses a head stack assembly and a disk drive using the head arm assembly.

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Dongguan, China

Fei He