Huazhong University of Science and Technology

Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.

Fei Chen

Hai Jin

Song Wu

Danqing Wei

Zhiyi Liu

A semiconductor device and a semiconductor die are disclosed. The semiconductor device includes: a SPAD wafer containing SPAD dies formed thereon with respective SPAD arrays; a TDC wafer containing TDC dies formed thereon with respective TDC arrays; and a logic wafer containing logic dies formed thereon with respective peripheral logic circuits. The SPAD wafer, TDC wafer and logic wafer are bonded in the sequence set forth. The TDC arrays and peripheral logic circuits are arranged on the TDC and logic wafers, respectively, and the SPAD arrays are bonded to the TDC arrays. The three wafers are bonded and integrated together to form the semiconductor device using a multi-wafer stacking technique. The increased integration of the semiconductor device means an increased fill factor of SPAD arrays for same size, resulting in improved photon detection efficiency of the semiconductor device and improved detection performance of single-photon detectors fabricated from the semiconductor device.

Semiconductor device and semiconductor die

The present invention involves with a dynamic distributed processing method for stream data, at least comprising: analyzing and predicting an execution mode of at least one data feature block of the data of a user stream data processing program; dynamically adjusting the execution mode based on an average magnitude of queue latency and a threshold of queue latency of the stream data; and processing corresponding said at least one data feature block based on the execution mode. By associating and combining the irrelevant data stream mode and micro-batch mode of stream data computing, the present invention successfully releases automatic shift and data process between the two modes, which advantageously has both the high throughput property and the low latency property.

Growing community of inventors

Hubei, China

Fei Chen