Intermolecular, Inc.

Sandisk Technologies Inc.

Kabushiki Kaisha Toshiba

Sandisk 3d LLC

Applied Materials, Inc.

Federico Nardi

Yun Yu Wang

Gerrit Jan Hemink

Christopher John Petti

Siddarth A Krishnan

Milind Ganesh Weling

Won Ho Choi

Tim Minvielle

Ryan C Clarke

Deepak Kamalanathan

Archana Kumar

Fuxi Cai

Toshiki Hirano

Guy Charles Wicker

Lidu Huang

Mark Harold Clark

Robert A Huertas

Mac D Apodaca

Sergey V Barabash

Randall Higuchi

Ming-Che Wu

Chu-Chen Fu

Ailian Zhao

Zhaoqiang Bai

Memory cells in a memory array may be configured to include a fuse that will blow in the case of a defective cell. In a 1T-1R memory cell, a fuse may be placed in series with the select element and/or the memory element to counteract a short-circuit in either of these elements. A fuse may be formed by selectively etching a phase-change material (PCM) between two electrodes to leave a cavity. When sufficient energy is applied to the PCM material, the PCM filament will break its crystalline structure and be distributed within the cavity. This prevents the PCM material from recrystallizing. Another fuse may be formed by depositing a material between two electrodes that is doped with mobile ions. When subjected to an excessive signal, the resulting electric field may push these ions permanently towards one of the electrodes, thereby permanently destroying the conductive pathway.

Two-terminal one-time programmable fuses for memory cells

A method for setting memory elements in a plurality of states includes applying a set signal to a memory element to transition the memory element from a low-current state to a high-current state; applying a partial reset signal to the memory element to transition the memory element from the high-current state to a state between the high-current state and the low-current state; determining whether the state corresponds to a predetermined state; and applying one or more additional partial reset signals to the memory element until the state corresponds to the predetermined current state. The memory element may be coupled in series with a transistor, and a voltage control circuit may apply voltages to the transistor to set and partially reset the memory element.

Soft reset for multi-level programming of memory cells in non-von neumann architectures

An apparatus performs vector matrix multiplication (VMM) for an analog neural network (ANN). The apparatus includes a column of NAND flash cells in series, where each NAND flash cell includes a control gate; a bit line connected to the column of NAND flash cells, where a current drawn from the NAND flash cells flows to the bit line; an integrator connected to the bit line; and a controller having programmed instructions to control the column of NAND flash cells by setting the voltage of the control gate of each NAND flash cell.

Vector matrix multiplication with 3D NAND

Systems and methods for performing in-storage logic operations using one or more memory cell transistors and a programmable sense amplifier are described. The logic operations may comprise basic Boolean logic operations (e.g., OR and AND operations) or secondary Boolean logic operations (e.g., XOR and IMP operations). The one or more memory cell transistors may be used for storing user data during a first time period and then used for performing a logic operation during a second time period subsequent to the first time period. During the logic operation, a first memory cell transistor of the one or more memory cell transistors may be programmed with a threshold voltage that corresponds with a first input operand value and then a gate voltage bias may be applied to the first memory cell transistor during the logic operation that corresponds with a second input operand value.

In-storage logic for hardware accelerators

A non-volatile memory uses phase change memory (PCM) cells in a three dimensional vertical cross-point structure, in which multiple layers of word lines run in a horizontal direction and bit lines run in a vertical direction. The memory cells are located in a recessed region of the word lines and are separated from the bit line by an ovonic threshold switch. A surfactant lining of the word line recess in which the phase change memory material is placed improves stability of the resistance state of the memory cells, allowing for improved multi-state operation.

Methods of forming a phase change memory with vertical cross-point structure

Soft reset for multi-level programming of memory cells in non-Von Neumann architectures

The switching device includes three terminals including an inner surface, an oxide layer on the inner surface of the third terminal, and a chalcogenide pillar extending through the oxide layer and the third terminal, the pillar being in electrical communication with the first terminal and the second terminal, wherein the voltage difference between the first terminal and the second terminal changes the channel from a first state to a second state when a threshold voltage between the first terminal and the second terminal is exceeded, the threshold voltage being dependent on temperature. The third terminal is resistive and receives a control signal to apply heat to the pillar and modulate the threshold voltage. The switching device can be used to select the memory stack through the bitline and provide a nearly limitless current based on the threshold switching conduction providing avalanche current conduction through the switching device.

Threshold switch for memory

Multi-state phase change memory device with vertical cross-point structure

Systems and methods for providing a one-time programmable chalcogenide-based memory with improved memory cell IV characteristics are described. The memory cells of the one-time programmable chalcogenide-based memory may include a chalcogenide-based material. The chalcogenide-based material may comprise a germanium-antimony-tellurium compound (GST), a chalcogenide glass, or a chalcogenide alloy such as GeSeAsor GeTeAs. The chalcogenide-based memory may be written as a one-time programmable memory in which forming operations are performed on only memory cells that are to be programmed to store a first binary value (e.g., binary '1' data values) and not performed on other memory cells that are to store a second binary value different from the first binary value (e.g., binary '0' data values).

Write-once read-many amorphous chalcogenide-based memory

Multi-state and confined phase change memory with vertical cross-point structure

Systems and methods for providing a phase change memory that includes a phase change material, such as a chalcogenide material, in series with a heating element that comprises multiple thermal interfaces are described. The multiple thermal interfaces may cause the heating element to have a reduced bulk thermal conductivity or a lower heat transfer rate across the heating element without a corresponding reduction in electrical conductivity. The phase change material may comprise a germanium-antimony-tellurium compound or a chalcogenide glass. The heating element may include a plurality of conducting layers with different thermal conductivities. In some cases, the heating element may include two or more conducting layers in which the conducting layers comprise the same electrically conductive material or compound but are deposited or formed using different temperatures, carrier gas pressures, flow rates, and/or film thicknesses to create thermal interfaces between the two or more conducting layers.

Phase change memory electrode with multiple thermal interfaces

First electrically conductive lines can be formed over a substrate. A two-dimensional array of vertical stacks can be formed, each of which includes a first electrode, an in-process resistive memory material portion, and a second electrode over the first electrically conductive line. The sidewalls of the in-process resistive memory material portions are laterally recessed with respect to sidewalls of the first electrode and the second electrode to form resistive memory material portions having reduced lateral dimensions. A dielectric material layer is formed by an anisotropic deposition to form annular cavities that laterally surround a respective one of the resistive memory material portions. Second electrically conductive lines can be formed on the second electrodes.

Resistive memory device including a lateral air gap around a memory element and method of making thereof

Provided are memory cells, such as resistive random access memory (ReRAM) cells, each cell having multiple metal oxide layers formed from different oxides, and methods of manipulating and fabricating these cells. Two metal oxides used in the same cell have different dielectric constants, such as silicon oxide and hafnium oxide. The memory cell may include electrodes having different metals. Diffusivity of these metals into interfacing metal oxide layers may be different. Specifically, the lower-k oxide may be less prone to diffusion of the metal from the interfacing electrode than the higher-k oxide. The memory cell may be formed to different stable resistive levels and then resistively switched at these levels. Each level may use a different switching power. The switching level may be selected a user after fabrication of the cell and in, some embodiments, may be changed, for example, after switching the cell at a particular level.

Two stage forming of resistive random access memory cells

Provided are hybrid electrodes comprising base structures and plugs disposed within the base structures. Also provided are selector elements comprising such hybrid electrodes and memory arrays with selector elements used for addressing individual memory cells. Specifically, the base structure and plug of a hybrid electrode have different compositions but both interface the same dielectric of the selector element. This design allows anti-parallel diode and other configurations with a very few components. The base structure and plug may have different dopants, different stoichiometry of the same alloy, or formed from completely different materials. The interfacing surface portions of a hybrid electrode may have different sizes. A combination of these surface portions (e.g., areas, surface conditions) and materials (e.g., compositions) can be used for tuning operating characteristics of selector elements using such hybrid electrodes.

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Federico Nardi