Applied Materials, Inc.

Fayez E Abboud

Shinichi Kurita

Benjamin M Johnston

Hung T Nguyen

Matthias Brunner

Ralf Schmid

John M White

Emanuel Beer

James Craig Hunter

Sriram Krishnaswami

Paul Bocian

Jan M Chabala

A method for testing a plurality of electronic devices formed on a large area substrate is described. In one embodiment, the method includes transferring a substrate on an end effector relative to a testing platform having a plurality of testing columns coupled thereto, the substrate having a plurality of electronic devices located thereon, and moving the substrate in a single directional axis relative to an optical axis of each of the plurality of testing columns, the single directional axis being substantially orthogonal to the optical axis to define a test area on the substrate, wherein the test area is configured to cover an entire length or an entire width of the substrate such that the testing columns are capable of testing the entire substrate as the substrate is moved through the test area.

In-line electron beam test system

A system and method for supporting and transferring a substrate relative to a plurality of testing columns are provided. The system includes a testing table adapted to support and move the substrate relative to the plurality of testing columns. The testing table may include an end effector disposed therein to transfer the substrate relative to an upper surface of the testing table. The method includes transferring the substrate to the testing table and moving the substrate relative to the plurality of testing columns. Signals indicative of electronic device performance are sensed to determine operability of the devices on the substrate.

Integrated substrate transfer module

A method and apparatus for testing a plurality of electronic devices formed on a large area substrate is described. In one embodiment, the apparatus performs a test on the substrate in one linear axis in at least one chamber that is slightly wider than a dimension of the substrate to be tested. Clean room space and process time is minimized due to the smaller dimensions and volume of the system.

An improved prober for an electronic devices test system is provided. The prober is 'configurable,' meaning that it can be adapted for different device layouts and substrate sizes. The prober generally includes a frame, at least one prober bar having a first end and a second end, a frame connection mechanism that allows for ready relocation of the prober bar to the frame at selected points along the frame, and a plurality of electrical contact pins along the prober bar for placing selected electronic devices in electrical communication with a system controller during testing. In one embodiment, the prober is be used to test devices such as thin film transistors on a glass substrate. Typically, the glass substrate is square, and the frame is also square. In this way, 'x' and &#x201c;y&#x201d; axes are defined by the frame. The electrical pins may be movable along the axial length of the prober bars, or may be selectively pushed down to contact selected contact pads on the substrate.

Configurable prober for TFT LCD array test

A substrate table and method for supporting and transferring a substrate are provided. The substrate table includes a segmented stage having an upper surface for supporting a substrate, and an end effector. The end effector includes two or more spaced apart fingers and an upper surface for supporting a substrate. The end effector is at least partially disposed and moveable within the segmented stage such that the fingers of the end effector and the segmented stage interdigitate to occupy the same horizontal plane. The segmented stage is adapted to raise and lower about the end effector.

A scanning lithography tool exposes a medium in a raster scan. The raster scan is a multi-pass scan in which the shape of the beam, while fixed for any one pass, is altered between passes. Thus, certain pixels are exposed in one or more scans using a Gaussian (round) beam while other pixels are exposed in separate scans using, for instance, a shaped (e.g., square or rectangular) shaped beam. Beam shape here refers to the cross-sectional shape of the beam as incident on the medium. This process, especially when the shaped beam is applied at the corners and slanted edges of a feature being exposed, has been found to substantially reduce the problem of edge blur otherwise typical of raster scan lithography. This process is applicable to both electron beam and laser beam raster scanning lithography.

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Pleasanton, CA, United States of America

Fayez E Abboud