Kla Tencor Corporation

Kla Corporation

Fatima Anis

Mark Davis Smith

William Pierson

Onur Demirer

Jeremy Nabeth

Hoyoung Heo

Christian Sparka

Stuart Sherwin

Ramkumar Karur-Shanmugam

Onur Nihat Demirer

Choon (George) Hoong Hoo

An overlay control system is disclosed. In embodiments, the system may include a controller configured to: acquire a set of feedback overlay measurements based on a plan of record (POR) sampling map on a second layer of samples of at least one previous lot of samples; generate a reference wafer overlay map based on the set of feedback overlay measurements; acquire a set of feedforward overlay measurements based on a feedforward sampling map on a first layer of a set of samples of a current lot of samples; generate a set of artificial overlay vector maps for the set of samples of the current lot of samples based on the set of feedforward overlay measurements; and cause a lithography tool to fabricate a second layer of samples of the current lot of samples based on the reference wafer overlay map and the set of artificial overlay vector maps.

System and method for wafer-by-wafer overlay feedforward and lot-to-lot feedback control

A semiconductor tool includes an illumination source to generate an illumination beam, one or more illumination optical elements to direct a portion of the illumination beam to a sample, a detector, one or more collection optical elements to direct radiation emanating from the sample to the detector, and a controller communicatively coupled to the detector. The controller is configured to measure alignment at a plurality of locations across the sample to generate alignment data, select an analysis area for alignment zone determination, divide the analysis area into two or more alignment zones having different alignment signatures; model the alignment data of at least a first alignment zone of the two or more alignment zones using a first alignment model, and model the alignment data of at least a second alignment zone of the two or more alignment zones using a second alignment model different than the first alignment model.

Systems and methods for automated multi-zone detection and modeling

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Milpitas, CA, United States of America

Fatima Anis