Intel Corporation

Farzaneh Yahyaei-moayyed

David Gregory Figueroa

Chee-Yee Chung

Kristopher J Frutschy

Yuan-Liang Li

Dong Zhong

Bob Sankman

Kris Frutschy

Glenn E Stewart

Jiangqi He

Chris Baldwin

Geoffery L Reid

Geoffrey L Reid

According to some embodiments, a capacitor includes a first external capacitor plane including a first at least one terminal of a first polarity, and a first internal capacitor plane including a second at least one terminal of the first polarity. The second at least one terminal of the first polarity may be electrically coupled to the first at least one terminal of the first polarity, and a total area of the second at least one terminal of the first polarity may be less than a total area of the first at least one terminal of the first polarity.

Capacitor design for controlling equivalent series resistance

An electronic assembly includes one or more conductive clamps (, FIG.), which are used to supply current to an integrated circuit (IC) package (). The conductive clamps are attached to a printed circuit (PC) board (), which supplies the current to the IC package over one clamp, and receives returned current from the IC package over another clamp. Each clamp contacts a contact pad () on the surface of the PC board, and contacts another contact pad () on the top surface of the IC package. Vias () and conductive planes () within the package then carry current to and from an IC (e.g., IC) connected to the package. In another embodiment, the clamp (, FIG.) holds a conductive structure () in place between the PC board contact pad () and the IC package contact pad (), and current is carried primarily over the conductive structure, rather than over the clamp.

Printed circuit board housing clamp

A method for fabricating a socket (FIG.) includes fabricating a conductive structure (FIG.) and embedding the conductive structure in a housing (). The housing includes multiple openings () formed in the top surface. Each opening () provides access to conductive contacts (FIG.), which provide an electrical interface between a device that is inserted into the socket and the next level of interconnect (e.g., a PC board). In one embodiment, the embedded conductive structure () is electrically connected to one or more ground conducting contacts (FIG.B). The conductive structure includes column walls (), which run in parallel with columns of contacts, and row walls (), which run in parallel with rows of contacts and which intersect the column walls. In this manner, the conductive structure forms multiple chambers (FIG.).

Method of fabrication for a socket with embedded conductive structure

An integrated circuit including a die, a power terminal and a ground terminal all mounted onto a substrate. The power terminal including a body and a first extension projecting from the body, and the ground terminal including a body and a second extension projecting from the body. The second extension on the ground terminal being adjacent to the first extension on the power terminal to offset inductance that is generated by supplying current to the die through the power terminal.

Power/ground configuration for low impedance integrated circuit

An electronic assembly includes one or more conductive clamps ( FIG. 3), which are used to supply current to an integrated circuit (IC) package ( ). The conductive clamps are attached to a printed circuit (PC) board ( ), which supplies the current to the IC package over one clamp, and receives returned current from the IC package over another clamp. Each clamp contacts a contact pad ( ) on the surface of the PC board, and contacts another contact pad ( ) on the top surface of the IC package. Vias ( ) and conductive planes ( ) within the package then carry current to and from an IC (e.g., IC ) connected to the package. In another embodiment, the clamp ( FIG. 9) holds a conductive structure ( ) in place between the PC board contact pad ( ) and the IC package contact pad ( ), and current is carried primarily over the conductive structure, rather than over the clamp.

Circuit housing clamp and method of manufacture therefor

A system and method for embedding power and ground planes in a pin grid array (PGA) socket is provided. Integrated circuit pins are inserted into multiple insertion holes of varying dimensions in the power and ground planes. When the cover of the socket is slidably moved, power pins touch the power plane and ground pins touch the ground plane. Decoupling capacitors are also affixed to the substrate. Thus, the power delivery performance of the overall central processing unit (CPU) package is improved. Moreover, the power and ground planes enhance the mechanical strength of the socket which reduces warpage.

System and method for package socket with embedded power and ground planes

A socket ( , FIG. ) includes a housing ( ) with multiple openings ( ) formed in the top surface. Each opening ( ) provides access to conductive contacts ( , FIG. ), which provide an electrical interface between a device that is inserted into the socket and the next level of interconnect (e.g., a PC board). Embedded within the socket is a conductive structure ( , FIG. ). In one embodiment, the conductive structure is electrically connected to one or more ground conducting contacts ( , FIG. ). The conductive structure includes column walls ( ), which run in parallel with columns of contacts, and row walls ( ), which run in parallel with rows of contacts and which intersect the column walls. In this manner, the conductive structure forms multiple chambers ( , FIG. ). Each signal carrying and power conducting contact is positioned within a chamber. Accordingly, the walls of the conductive structure function as a ground plane that surrounds the signal carrying and power conducting contacts.

Growing community of inventors

Chandler, AZ, United States of America

Farzaneh Yahyaei-moayyed