International Business Machines Corporation

Farid Youssif Aoude

Shaji Farooq

Rao Venkateswara Vallabhaneni

Govindarajan Natarajan

Lester W Herron

Lawrence D David

Donald Rene Wall

Renuka S Divakaruni

Anthony Mastreani

Vivek M Sura

Hal Mitchell Lasky

Young-Ho Kim

Thomas M Shaw

George Frederick Walker

Emanuel Israel Cooper

Sarah Huffsmith Knickerbocker

Robert Anthony Rita

Srinivasa S Reddy

Peter Richard Duncombe

Jae M Park

Jungihl Kim

Robert R Shaw

Mark O Neisser

Edward A Giess

Friedel Muller-Landau

Jon A Van Hise

James M Brownlow, Deceased

Srinivasa S N Reddy

A copper-based paste is disclosed for filling vias in, and forming conductive surface patterns on, ceramic substrate packages for semiconductor chip devices. The paste contains copper aluminate powder in proper particle size and weight proportion to achieve grain size and shrinkage control of the via and thick film copper produced by sintering. The shrinkage of the copper material during sintering is closely matched to that of the ceramic substrate.

Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias

Copper-based paste containing copper aluminate for microstructural and

Improved vie-filling compositions for producing conductive vias in circuitized ceramic substrates, particularly multi-layer substrates, without cracking and/or loss of hermetic sealing. The via-filling compositions comprise pastes containing a mixture of (a) ceramic and/or glass spheres of substantially- uniform diameter between about 0.5 and 6 .mu.m, (b) conductive metal particles or spheres having a maximum dimension or diameter between about 1/3 and 1/4 of the diameter of the ceramic and/or glass spheres, and (c) a binder vehicle. The formed conductive via bodies comprise a uniform conductive skeletal network of sintered metal particles densely packed within a uniform matrix of the co-sintered ceramic and/or glass spheres, which matrix is hermetically fused and integrated with ceramic layers forming the wall of the via in the ceramic circuit substrate.

Process for producing ceramic circuit structures having conductive vias

Improved via-filling compositions for producing conductive vias in circuitized ceramic substrates, particularly multilayer substrates, without cracking and/or loss of hermetic sealing. The via-filling compositions comprise pastes containing a mixture of (a) ceramic and/or glass spheres of substantially- uniform diameter between about 0.5 and 6 .mu.m, (b) conductive metal particles or spheres having a maximum dimension or diameter between about 1/3 and 1/4 of the diameter of the ceramic and/or glass spheres, and (c) a binder vehicle. The formed conductive via bodies comprise a uniform conductive skeletal network of sintered metal particles densely packed within a uniform matrix of the co-sintered ceramic and/or glass spheres, which matrix is hermetically fused and integrated with ceramic layers forming the wall of the via in the ceramic circuit substrate.

Via paste compositions and use thereof to form conductive vias in

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Wappingers Falls, NY, United States of America

Farid Youssif Aoude