Applied Materials, Inc.

Farid Abooameri

Anisul Haque Khan

Wen Teh Chang

Gaurav Saraf

Xiawan Yang

Bradley Scott Hersch

John Patrick Holland

Alexander Miller Paterson

Xiaoping Zhou

Subhash Deshmukh

Sharma V Pamarthy

Jim Zhongyi He

Jivko Dinev

Dennis Koosau

Jeffrey William Dietz

Robert Scott Clark

Huutri Dao

Kelly A McDonough

David E Gutierrez

Declan Scanlan

Etch rate distributions are captured at a succession of hardware tilt angles of the RF source power applicator relative to the workpiece and their non-uniformities computed, and the behavior is modeled as a non-uniformity function for each one of at least two plasma reactors. An offset &#x394;&#x3b1; in tilt angle &#x3b1; between the non-uniformity functions of the two plasma reactors is detected. The two plasma reactors are then matched by performing a hardware tilt in one of them through a tilt angle equal to the offset &#x394;&#x3b1;.

Method of matching two or more plasma reactors

Etch rate distribution non-uniformities are predicted for a succession of hardware tilt angles of the RF source applicator relative to the workpiece, and the behavior is modeled as a non-uniformity function for each one of at least two plasma reactors. An offset &#x394;&#x3b1; in tilt angle &#x3b1; between the non-uniformity functions of the two plasma reactors is detected. The two reactors are then matched by performing a hardware tilt in one of them through a tilt angle equal to the offset &#x394;&#x3b1;.

Predictive method of matching two plasma reactors

Embodiments of the invention provide a method and apparatus, such as a processing chamber, suitable for etching high aspect ratio features. Other embodiments include a showerhead assembly for use in the processing chamber. In one embodiment, a processing chamber includes a chamber body having a showerhead assembly and substrate support disposed therein. The showerhead assembly includes at least two fluidly isolated plenums, a region transmissive to an optical metrology signal, and a plurality of gas passages formed through the showerhead assembly fluidly coupling the plenums to the interior volume of the chamber body.

Apparatus for etching high aspect ratio features

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Pleasanton, CA, United States of America

Farid Abooameri