Cisco Technology, Inc.

Farhad Pakravan

John Benjamin Levy

John Martin

John G Kelly

Marvin Milock

In one embodiment, an apparatus includes a card chamber, an air intake, an airway, an exhaust plenum, and at least one fan. At least one electronics card can be supported in the card chamber. Ambient air from outside the apparatus can flow into the card chamber via the air intake. The airway is located across the card chamber from the air intake. Air flows substantially linearly across the card chamber from the intake to the airway. The exhaust plenum is located adjacent the card chamber and the airway. The fan is operable to draw air from the airway into the exhaust plenum.

Air-cooling of electronics cards

A data communications system includes optic adaptors that provide an interface between multiple line card chassis and a fabric card chassis. Optic adaptors can be added to the system to allow the addition of a number of line card chassis, thereby increasing the overall bandwidth of the system. The optic adaptors can also be separated from the fabric card chassis and line card chassis and upgraded to allow an increase in the overall bandwidth of the system. For example, optic adaptors that provide optical connections between a first number of line card chassis and the fabric card chassis can be detached from both the fabric card chassis and the respective line card chassis. Optic adaptors that provide optical connections between the fabric card chassis and a second, increased number of line card chassis are then installed within the fabric card chassis thereby allowing the additional line card chassis to be connected to the fabric card chassis.

Optical connection adaptors for a data communications device and methods of use

A test site is incorporated on a circuit board having a set of test connections passing through a test via on respective test connection layer, the test connection layers including (1) a first layer adjacent to a target layer, and (2) a second layer spaced apart from the target layer with the first layer therebetween. The test via is back-drilled from the direction of the second layer to remove undesired via metallization, breaking the test connections of all the layers through which it passes, and the continuity of the test connections is measured to determine a pattern of broken and non-broken test connections resulting from the back-drilling. The pattern of broken and non-broken test connections is examined to ascertain the actual depth of the back-drilling in relation to the target layer.

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Los Altos, CA, United States of America

Farhad Pakravan