Designer Molecules, Inc.

Henkel Corporation

The Dexter Corporation

Farhad G Mizori

Stephen M Dershem

Puwei Liu

James T Huneke

The invention is based on the discovery that a remarkable improvement in the performance of maleimide thermosets can be achieved by incorporating amide-extended maleimides into an adhesive formulation. Amide-extended maleimides described herein can be used to toughen bismaleimide thermosetting materials without sacrificing any thermal stability. Amide-extended maleimides are readily prepared by reacting a bismaleimide with an appropriate amine via the well-known Michael addition reaction. Acylation of the resulting secondary amines provides the amide-extended maleimide. The acylating agent can also be used to introduce polymerizable functional groups into the backbones of these thermoset monomers. Amide-extended acrylate and methacrylate monomers can also be prepared.

Amide-extended crosslinking compounds and methods for use thereof

Low viscosity, radiation curable compositions have been developed that produce plastics with silicone rubber-like properties. These compositions have also been shown to give great adhesion to plastics. The combination of an ethylenically unsaturated oligomer with di- or polythiol compound, reactive diluents and a radical initiator will produce these properties. These materials can find use in many areas such as: Electronics packaging, displays, conformal coatings, seals, gaskets, fiber optics coatings, and golf ball coatings.

Curable composition with rubber-like properties

The present invention provides polyimide polymer materials for passivating semiconductor wafers and methods for fabricating thereof. The present invention further provides a device that includes a semiconductor wafer and a passivating layer disposed on the surface of the wafer, wherein the passivating layer comprises such polyimide polymers.

Materials and methods for stress reduction in semiconductor wafer passivation layers

The invention is directed to maleimide thermosets incorporating imide-extended mono-, bis-, or polymaleimide compounds. These imide-extended maleimide compounds are prepared by the condensation of appropriate anhydrides with appropriate diamines to give amine terminated compounds. These compounds are then condensed with excess maleic anhydride to yield imide-extended maleimide compounds.

Imide-linked maleimide and polymaleimide compounds

The invention provides hetero-functional compound compounds useful in a variety of adhesive applications. More particularly, the invention provides compounds bearing at least one electron rich olefinic bond and at least one electron poor olefinic bond, wherein the two olefinic bonds are separated by a Cto about Caliphatic, cycloaliphatic, or aromatic spacer.

Hetero-functional compounds and methods for use thereof

The invention is based on the discovery that a remarkable improvement in the performance of maleimide thermosets can be achieved through the incorporation of imide-extended mono-, bis-, or polymaleimide compounds. These imide-extended maleimide compounds are readily prepared by the condensation of appropriate anhydrides with appropriate diamines to give amine terminated compounds. These compounds are then condensed with excess maleic anhydride to yield imide-extended maleimide compounds.

The invention is based on the discovery that certain polyester compounds bearing are useful as b-stageable and/or liquid adhesives for the microelectronic packaging industry.

Free-radical curable polyesters and methods for use thereof

The invention is based on the discovery that certain polyester compounds bearing free-radical curable moieties are useful as b-stageable adhesives for the microelectronic packaging industry.

The invention is based on the discovery that certain well-defined functionalized cyclic siloxanes are useful as thermosetting resins for the electronic packaging industry. The functionalized cyclic siloxane compounds described herein can be cured in a variety of ways, depending on the polymerizable moiety incorporated into the compound. Invention cyclic siloxanes are readily prepared via hydrosilation of polyalkyl(hydro)cyclosiloxanes with appropriately functionalized alkenes and/or alkynes.

Adhesive compositions containing cyclic siloxanes and methods for use thereof

In accordance with the present invention, there are provided novel benzoxazine compounds and thermosetting resin compositions prepared therefrom. Invention compositions are particularly useful for increasing adhesion at interfaces within microelectronic packages. Invention benzoxazines are useful for the preparation of invention compositions with properties which are associated with increased adhesion at interfaces, such as, for example, low shrinkage on cure and low coefficient of thermal expansion (CTE). In another aspect of the invention, there are provided die-attach pastes having increased interfacial adhesion. Invention die-attach pastes include benzoxazine-containing thermosetting resin compositions. In further aspects of the invention, there are provided methods for enhancing adhesive strength of thermosetting resin compositions and methods for enhancing adhesion of a substrate bound to a metallic surface by a thermosetting resin composition.

Benzoxazines, thermosetting resins comprised thereof, and methods for use thereof

The invention is based on the discovery that certain polyester compounds bearing free-radical curable moieties are useful as b-stageable adhesives for the microelectonic packaging industry.

The invention is based on the discovery that a remarkable improvement in the performance of bismaleimide thermosets can be achieved through the incorporation of an imide-extended liquid bismaleimide monomer. This imide-extended liquid bismaleimide monomer is readily prepared by the condensation of an appropriate dianhydride with two equivalents of an appropriate diamine to give an amine terminated compound. This compound is then condensed with an excess of maleic anhydride to yield an imide-extended liquid bismaleimide monomer.

Growing community of inventors

La Mesa, CA, United States of America

Farhad G Mizori