Nikon Corporation

Nikon Research Corporation of America

Fardad A Hashemi

Travis D Bow

Douglas C Watson

Christopher S Margeson

Henry Kin Heng Pang

Henry Pang

Alton Hugh Phillips

Patrick S Chang

Method and system for defining basis functions for fitting distortions of profiles of objects in a batch, that has undergone a fabrication process, in a manner adaptable to the fabrication process to reduce the errors between profiles approximated with the use of such basis functions and actual object profiles. Process-specific individual basis functions are defined based on spatially-dense measurement of objects from training sub-set of the batch and applying learning algorithm to results of such measurement. Advantages of process-adaptable basis functions over generic basis functions for fitting distortion shapes of objects include higher accuracy of fitting either at larger or a fewer locations across the object.

Determination of customized components for fitting wafer profile

Lithographic exposure tool and method for operating thereof are provided that includes modification of the tool (assessed based on the measurements of geometrical distortions caused, in the tool, by the exposure process and used to train the exposure tool) to ensure that such geometrical distortions are reduced for any chosen exposure process. The method includes processing first data (representing distortions caused by initial exposure run(s)) to estimate second data (representing distortions that would occur for another exposure run); and forming a modified exposure tool by changing at least one of a) a geometrical path or a path along which the workpiece stage is repositioned during the operation of the exposure tool; b) one or more of a presence, position, orientation, size and shape of an optical component of an optical projection sub-system of the optical system of the exposure tool; and c) a parameter of scanning synchronization of the exposure tool.

Lithographic thermal distortion compensation with the use of machine learning

Lithographic exposure tool and method for operating thereof that includes modification of the tool (assessed based on the measurements of geometrical distortions caused, in the tool, by the exposure process and used to train the exposure tool) to ensure that such geometrical distortions are reduced for any chosen exposure process. The method includes processing first data (representing distortions caused by initial exposure run(s)) to estimate second data representing distortions that would occur for another exposure run); and forming a modified exposure tool by changing at least one of a) a geometrical path is a path along which the workpiece stage is repositioned during the operation of the exposure tool; b) one or more of a presence, position, orientation, size and shape of an optical component of an optical projection sub-system of the optical system of the exposure tool; and c) a parameter of scanning synchronization of the exposure tool.

A clamp for selectively inhibiting movement of a first object relative to a second object includes (i) a first clamp component coupled to the first object; (ii) a second clamp component coupled to the second object; and (iii) a fluid source that directs a fluid to the second clamp component to create a fluid bearing between the first clamp component and the second clamp component that allows for movement of the first clamp component relative to the second clamp component, and wherein the fluid source directs less fluid to the second clamp component to inhibit relative movement.

Precision clamp

A system and method for clamping wafers together in alignment using pressure. The system and method involves holding a first wafer and a second wafer together in alignment using a wafer clamp within an ambient environment maintained at a first pressure and creating a second pressure at least partially around and between the first wafer and the second wafer held together by the wafer clamp, wherein the first pressure is greater than the second pressure. The first wafer and the second wafer are clamped together in alignment using a pneumatic force created by a pressure differential between the first pressure and the second pressure.

System and method for clamping wafers together in alignment using pressure

A chamber assembly () for providing a sealed chamber () adjacent to a workpiece () to counteract the influence of gravity on the workpiece () includes a chamber housing (), and a seal assembly () that expands and/or contracts to better seal against the workpiece (). Further, the chamber assembly () can include one or more transducer assemblies () that expand or contract to quickly respond to leaks or injections of fluid in chamber assembly () to maintain a constant and stable chamber pressure in the chamber assembly (). Moreover, the chamber assembly () can utilize a pressure source () that directs a lager amount of fluid () through a fluid passageway () to accurately maintain the pressure within the chamber assembly ().

Vacuum chamber assembly for supporting a workpiece

An exemplary device includes first and second portions that are movably connected together by first and second sets, respectively, of multiple blades interleaved with each other at an overlap region. When the overlap region is compressed, displacement of the first and second portions relative to each other is prevented so as to provide relatively high stiffness in first and second orthogonal directions (e.g., z- and y-directions) and relatively low stiffness in a third orthogonal direction (e.g., x-direction). The device can be used in coordination with an actuator, wherein operation of the actuator and compression of the overlap region are automated.

Multiple-blade holding devices

A precision assembly () for fabricating a substrate () includes a precision fabrication apparatus (), a pedestal assembly () and a suspension system (). The precision fabrication apparatus () fabricates the substrate (). The pedestal assembly () supports at least a portion of the fabrication apparatus (). The suspension system () inhibits the transfer of motion between the mounting base () and the pedestal assembly (). The suspension system () can include (i) a first boom () that is coupled to the mounting base () and the pedestal assembly (), the first boom () being pivotable coupled to at least one of the mounting base () and the pedestal assembly (), and (ii) a first resilient assembly () that is coupled between the mounting base () and at least one of the first boom () and the pedestal assembly (). The first resilient assembly () can function similar to a zero length spring over an operational range of the resilient assembly (). With this design, the components of the precision fabrication apparatus () are better protected by the suspension system () during a seismic disturbance. This reduces the likelihood of damage and misalignment of the components of the precision fabrication apparatus () during the seismic disturbance.

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Moraga, CA, United States of America

Fardad A Hashemi