Lam Research Corporation

Fangli J Hao

Eric H Lenz

Yuehong Fu

Rajinder Dhindsa

Zhigang Chen

Albert R Ellingboe

Keith E Dawson

John Edward Daugherty

Duane Outka

Leonard John Sharpless

Ian J Kenworthy

Allan Kent Ronne

Yijun Du

Hong Shih

Dean Jay Larson

Tuochuan Huang

Fred Egley

Bruno Morel

Javad Pourhashemi

Josh Cormier

A substrate support for supporting a substrate in a substrate processing system includes a baseplate and a ceramic layer arranged above the baseplate. An outer perimeter of the ceramic layer is surrounded by an edge ring. An outer radius of the ceramic layer is greater than an inner radius of the edge ring such that an outer edge of the ceramic layer extends below the edge ring.

Substrate support with improved process uniformity

A substrate support includes a baseplate, a ceramic layer arranged on the baseplate, a bond layer arranged in a first gap between the baseplate and the ceramic layer, a channel formed through the baseplate, the bond layer, and the ceramic layer, and a plug arranged in the channel. The plug includes a lower portion arranged in the baseplate and an upper portion arranged in the ceramic layer. The lower portion includes a pocket and sidewalls surrounding the pocket. The upper portion extends below the ceramic layer and the first gap into the pocket, the sidewalls of the lower portion overlap the upper portion, and a second gap between the upper portion and the lower portion is located within the pocket of the lower portion below the first gap.

Helium plug design to reduce arcing

A substrate support includes a conductive baseplate arranged to support a ceramic layer. The conductive baseplate includes a first cavity extending along an axis perpendicular to a horizontal plane defined by the conductive baseplate. A coupling assembly is arranged within the first cavity. The coupling assembly includes a gear configured to rotate about the axis. A pin arranged within the first cavity extends along the axis through the gear and into a second cavity below the conductive baseplate. Rotation of the gear causes the pin to move upward or downward relative to the conductive baseplate. The pin is retained within the second cavity when the gear is rotated to cause the pin to move downward into the second cavity.

Boltless substrate support assembly

A pin lifter assembly for a substrate support in a substrate processing system includes a lift pin having a shaft, an upper end, and a lower end, and an insert arranged around the lift pin. The insert defines a gap between the insert and the lift pin. A clamp assembly is arranged around the lower end of the lift pin. The lower end of the lift pin is secured within the clamp assembly such that the clamp assembly prevents vertical movement of the lift pin relative to the clamp assembly. The clamp assembly is configured to allow horizontal movement of the lower end of the lift pin within the clamp assembly.

Pin lifter assembly with small gap

A gas delivery system for a plasma process system such as a plasma etching system wherein inner surfaces of gas passages are coated with a corrosion-resistant material coating formed by curing a layer of fluidic precursor deposited on the inner surfaces. The coating can be formed by (a) flowing a fluidic precursor of a corrosion-resistant material through the gas passages and depositing a layer of the fluidic precursor to completely coat the inner surfaces of the gas passages; (b) removing excess fluidic precursor from the inner surfaces; (c) curing the deposited layer of the fluidic precursor to form a corrosion-resistant material coating.

Coating method for gas delivery system

An aspect of the present invention is drawn to a device for use with an electrostatic chuck having a top surface and a bottom surface, the top surface being separated from the bottom surface by a width, the electrostatic chuck additionally having a hole therein, the hole having a first width at the top surface and having a second width at the bottom surface, the first width being less than the second width, the top surface being capable of having wafer disposed thereon. The device includes a pin, a shaft, a neck portion and an outer housing portion. The pin has a pin width less than the first width. The shaft has a pin-holding portion, an end portion and a central portion disposed between the pin-holding portion and the end portion. The central portion has a first bearing portion. The outer housing portion has a first end and a second end and includes a second bearing portion. The shaft is disposed within the outer housing portion and is moveable relative to the outer housing portion. The neck portion is disposed at the first end. The second bearing portion is stationary relative to the neck portion. The first bearing portion is movable relative to the second bearing portion.

Pin lifting system

An automated hydrogen bubble detection apparatus includes a horizontal support surface on which a test coupon can be supported, a transparent tube having an open top and an open bottom and operable to contain a test solution when positioned on a test coupon, a camera arranged to view a test solution in the transparent tube, and a controller in communication with the camera and effective to operate the camera such that at least one video segment is recorded by the camera and analyzed to detect first bubble and continuous bubble generation. A method of evaluating corrosion resistance of coatings on aluminum and steel in acidic solution is also included.

Automated bubble detection apparatus and method

A method of coating the inner surfaces of gas passages of a gas delivery system for a plasma process system such as a plasma etching system includes (a) flowing a fluidic precursor of a corrosion-resistant material through the gas passages and depositing a layer of the fluidic precursor to completely coat the inner surfaces of the gas passages; (b) removing excess fluidic precursor from the inner surfaces; (c) curing the deposited layer of the fluidic precursor to form a corrosion-resistant material coating.

A port provides access to a process chamber interior for exemplary gas injection and process analysis and measurement. Centering the port in an external RF coil reduces the strength of an electric field across the port in generating plasma in the chamber. Plasma-induced etching and deposition in a bore of a gas injection injector mounted in the port is reduced by a grounded shield surrounding a region defined by the port, extending the life of the injector and of a chamber window in which the port is provided. The shield surrounds the region, and is configured with a longitudinally-extending slot defining a retainer arm and a flexure junction, and with a retainer foot on the arm. The junction urges the arm to extend the foot into a retainer groove of the port, and flexes to permit foot movement out of the groove in removal of the shield from the port.

Apparatus for shielding process chamber port

A plasma processing system for processing a substrate is disclosed. The plasma processing system includes a process chamber within which a plasma is both ignited and sustained for processing. The plasma processing system further includes an electrode disposed at the lower end of the process chamber. The electrode is configured for generating an electric field inside the process chamber. The plasma processing system also includes a component for controlling an impedance between the electrode and the plasma. The impedance is arranged to affect the electric field to improve processing uniformity across the surface of the substrate.

Lower electrode design for higher uniformity

A method for configuring a gas distribution channel, the gas distribution channel being configured for introducing a plasma source gas into a plasma processing chamber of a plasma processing system is disclosed. The method includes providing a metal conduit, providing a thermo-plastic tubular structure, and disposing the thermoplastic tubular structure within the metal conduit. The method also includes applying heat and pressure to the thermo-plastic tubular structure, thereby causing the thermo-plastic tubular structure to mechanically couple with the metal conduit wherein an outer surface of the thermo-plastic tubular structure is longitudinally coupled with an inner surface of the metal conduit.

Methods and apparatus for optimizing the delivery of a set of gases in a plasma processing system

A vacuum chamber with a cover with a first section, a second section, and a pocket between the first section and second section is provided. The vacuum chamber has a main cavity to which the first section is adjacent. The vacuum chamber may be used for plasma processing, which may require a critical element to be supported by the first section. The pocket is in fluid communication with the main cavity. When a vacuum is created in the main cavity, the pressure is also reduced in the pocket. As a result, the second section of the cover is deformed by the vacuum in the pocket. However, the vacuum in the pocket helps to prevent the first section from deforming, providing better support for the critical element.

Deformation reduction at the main chamber

This invention is an apparatus for purging unwanted gasses from the Front Opening Unified Pod (FOUP). It consists of a purging wand which is inserted into the chamber for an optimal purge. The purging wand moves back and forth along a simple axis activated by a linkage robot. The wand is carried along a track with the FOUP and when its reaches its optimal position inside the FOUP, the source of cleaning gas is allowed to flow into and spray out of the wand thereby purging the FOUP. After the purging is completed, the linkage robot withdraws the wand from within the FOUP to its original position.

Two position robot design for FOUP purge

A symmetrical semiconductor reactor for semiconductor processing, comprising a liner, a process chamber, a valve chamber, a slot valve plate, a liner aperture plate, a rod, and an actuator. The liner has a liner aperture adapted to provide passage for a wafer and to receive the liner aperture plate. The process chamber is coupled to the liner and the valve chamber. The actuator is coupled to the slot valve plate and moves the slot valve plate from the 'closed' to the 'open' position and vice versa. Since the slot valve plate is coupled to the liner aperture plate by the rod, the actuator is capable of moving the slot valve plate and the liner aperture plate at the same time. However, the precise movements of the liner aperture plate are dependent on the particular rod embodiment.

Growing community of inventors

Cupertino, CA, United States of America

Fangli J Hao