Innolux Corporation

Fang-Cheng Jhou

Tsu-Hsien Ku

I-Chang Liang

Ying-Yao Tang

Cheng-Wei Liu

Cheng-Chun Zhou

Chia-Wei Lai

Yuan-Jen Cheng

Li-Chi Luo

I-Jung Lin

Ruei-Ting Huang

An manufacturing method of an electronic device includes: providing a first substrate and a second substrate; providing an adhesive member between the first substrate and the second substrate; providing a first curved element and a second curved element opposite to the first curved element; arranging the second substrate on a curved top surface of the second curved element; arranging the first substrate between the first curved element and the second substrate; and pressurizing the first curved element and the second curved element, so that the first substrate and the second substrate are attached to each other through the adhesive member, thereby forming a curved composite component; wherein the first substrate is flat before the step of pressurizing the first curved element and the second curved element, and the first substrate becomes curved after the step of pressurizing the first curved element and the second curved element.

Manufacturing method of electronic device

A foldable electronic device is provided. The foldable electronic device includes a backboard, a supporting element disposed on the backboard, a composite panel disposed on the backboard, and an adhesive element disposed on the supporting element. The composite panel and the supporting element directly adhere to each other via the adhesive element. In a top view of the foldable electronic device, the adhesive element has first part and a second part, and the first part is separated to the second part.

Foldable electronic device

An manufacturing method of an electronic device includes: providing a first substrate and a second substrate; attaching an adhesive member onto the first substrate; and performing a curve attaching step, so that the first substrate and the second substrate are attached to each other through the adhesive member to form a curved composite component, wherein the curve attaching step is performed at a temperature of 20 degrees Celsius to 160 degrees Celsius.

An electronic device is provided. The electronic device includes a backboard, a circuit board disposed on the backboard, a light source disposed on the circuit board, a housing disposed on the backboard, and a panel disposed on the housing. The panel contacts the housing, and the light source and the circuit board are disposed between the panel and the backboard.

Electronic device with backboard and housing

An electronic device is provided. The electronic device includes a back frame, a panel disposed on the back frame, a protective substrate disposed on the panel, and an adhesive element disposed on a portion of the back frame. The back frame and the protective substrate adhere to each other via the adhesive element.

Electronic device having a curved surface

An electronic device having a curved surface is provided. The electronic device having the curved surface includes a back frame having a curved surface, a panel having a curved surface disposed on the back frame having the curved surface, a protective substrate having a curved surface disposed on the panel having the curved surface, and a patterned adhesive element disposed on a portion of the back frame having the curved surface. The back frame having the curved surface and the protective substrate having the curved surface adhere to each other via the patterned adhesive element. The method for fabricating the electronic device having the curved surface is also provided.

Electronic device having a curved surface and method for fabricating the same

A display device having a display region and a peripheral region surrounding the display region is provided. The display device includes a first adhesion layer sandwiched between a display unit and a protective structure. The protective structure includes a first protective layer having a first length in a first direction. The protective structure also includes a second adhesion layer disposed on the first protective layer. The protective structure further includes a second protective layer disposed on the second adhesion layer, and the second protective layer has a second length in the first direction, wherein the difference between the first length and the second length is between 0 and 1 mm, and wherein the second protective layer is on the outermost side of the display device.

Growing community of inventors

Miao-Li County, Taiwan

Fang-Cheng Jhou