Qualcomm Mems Technologies, Inc.

Lightwave Microsystems Corporation

Neophotonics Corporation

Lightwave Microsytstems Corporation

Fan Zhong

Yi Tao

Liang Zhao

Chun-Ming Wang

Lior Kogut

Farnaz Parhami

Hojin Lee

Stephen Zee

Jongik Won

Jonathan Bornstein

Michael Lennon

Calvin Ka Kuen Ho

Gang Xu

Marc Mignard

Teruo Sasagawa

Philip Don Floyd

David Leslie Heald

Wilhelmus Adrianus De Groot

Qi Luo

Sapna Patel

Nizar S Kheraj

Chengbin Qiu

Zhigang Zhou

Kangjie Li

Chengbin Qui

This disclosure provides systems, methods and apparatuses for pixel vias. In one aspect, a method of forming an electromechanical device having a plurality of pixels includes depositing an electrically conductive black mask on a substrate at each of four corners and along at least one edge region of each pixel, depositing a dielectric layer over the black mask, depositing an optical stack including a stationary electrode over the dielectric layer, and depositing a mechanical layer over the optical stack. The method further includes providing a conductive via in a first pixel of the plurality of pixels, the via disposed in the dielectric layer and electrically connecting the stationary electrode to the black mask, the via disposed in a position along an edge of the first pixel, spaced offset from the edge of the first pixel in a direction towards the center of the first pixel.

Pixel via and methods of forming the same

This disclosure provides systems, methods and apparatuses for pixel vias. In one aspect, a method of forming an electromechanical device having a plurality of pixels includes depositing an electrically conductive black mask on a substrate at each of four corners of each pixel, depositing a dielectric layer over the black mask, depositing an optical stack including a stationary electrode over the dielectric layer, depositing a mechanical layer over the optical stack, and anchoring the mechanical layer over the optical stack at each corner of each pixel. The method further includes providing a conductive via in a first pixel of the plurality of pixels, the via in the dielectric layer electrically connecting the stationary electrode to the black mask, the via disposed at a corner of the first pixel, offset from where the mechanical layer is anchored over the optical stack in an optically non-active area of the first pixel.

This disclosure provides mechanical layers and methods of forming the same. In one aspect, an electromechanical systems device includes a substrate and a mechanical layer having an actuated position and a relaxed position. The mechanical layer is spaced from the substrate to define a collapsible gap. The gap is in a collapsed condition when the mechanical layer is in the actuated position and in a non-collapsed condition when the mechanical layer is in the relaxed position. The mechanical layer includes a reflective layer, a conductive layer, and a supporting layer. The supporting layer is positioned between the reflective layer and the conductive layer and is configured to support the mechanical layer.

Mechanical layer and methods of forming the same

This disclosure provides mechanical layers and methods of forming the same. In one aspect, a method of forming a pixel includes depositing a black mask on a substrate, depositing an optical stack over the black mask, and forming a mechanical layer over the optical stack. The black mask is disposed along at least a portion of a side of the pixel, and the mechanical layer defines a cavity between the mechanical layer and the optical stack. The mechanical layer includes a reflective layer, a dielectric layer, and a cap layer, and the dielectric layer is disposed between the reflective layer and the cap layer. The method further includes forming a notch in the dielectric layer of the mechanical layer along the side of the pixel so as to reduce the overlap of the dielectric layer with the black mask along the side of the pixel.

Mechanical layer and methods of making the same

A method of shaping a mechanical layer is disclosed. In one embodiment, the method comprises depositing a support layer, a sacrificial layer and a mechanical layer over a substrate, and forming a support post from the support layer. A kink is formed adjacent to the support post in the mechanical layer. The kink comprises a rising edge and a falling edge, and the kink can be configured to control the shaping and curvature of the mechanical layer upon removal of the sacrificial layer.

Mechanical layer and methods of shaping the same

Embodiments of MEMS devices include support structures having substantially vertical sidewalls. Certain support structures are formed through deposition of self-planarizing materials or via a plating process. Other support structures are formed via a spacer etch. Other MEMS devices include support structures at least partially underlying a movable layer, where the portions of the support structures underlying the movable layer include a convex sidewall. In further embodiments, a portion of the support structure extends through an aperture in the movable layer and over at least a portion of the movable layer.

MEMS devices having support structures with substantially vertical sidewalls and methods for fabricating the same

An electromechanical systems device includes a plurality of supports disposed over a substrate and a deformable reflective layer disposed over the plurality of supports. The deformable reflective layer includes a plurality of substantially parallel columns extending in a first direction. Each column has one or more slots extending in a second direction generally perpendicular to the first direction. The slots can be created at boundary edges of sub-portions of the columns so as to partially mechanically separate the sub-portions without electrically disconnecting them. A method of fabricating an electromechanical device includes depositing an electrically conductive deformable reflective layer over a substrate, removing one or more portions of the deformable layer to form a plurality of electrically isolated columns, and forming at least one crosswise slot in at least one of the columns.

Display device with openings between sub-pixels and method of making same

Embodiments of MEMS devices include a movable layer supported by overlying support structures, and may also include underlying support structures. In one embodiment, the residual stresses within the overlying support structures and the movable layer are substantially equal. In another embodiment, the residual stresses within the overlying support structures and the underlying support structures are substantially equal. In certain embodiments, substantially equal residual stresses are be obtained through the use of layers made from the same materials having the same thicknesses. In further embodiments, substantially equal residual stresses are obtained through the use of support structures and/or movable layers which are mirror images of one another.

Electromechanical device configured to minimize stress-related deformation and methods for fabricating same

Disclosed is a microelectromechanical system (MEMS) device and method of manufacturing the same. In one aspect, MEMS such as an interferometric modulator include one or more elongated interior posts and support rails supporting a deformable reflective layer, where the elongated interior posts are entirely within an interferometric cavity and aligned parallel with the support rails. In another aspect, the interferometric modulator includes one or more elongated etch release holes formed in the deformable reflective layer and aligned parallel with channels formed in the deformable reflective layer defining parallel strips of the deformable reflective layer.

MEMS devices having improved uniformity and methods for making them

A thin black mask is created using a single mask process. A dielectric layer is deposited over a substrate. An absorber layer is deposited over the dielectric layer and a reflector layer is deposited over the absorber layer. The absorber layer and the reflector layer are patterned using a single mask process.

Device having thin black mask and method of fabricating the same

MEMS device having support structures configured to minimize stress-related deformation and methods for fabricating same

In various embodiments described herein, methods for forming a plurality of microelectromechanical systems (MEMS) devices on a substrate are described. The MEMS devices comprise x number of different sacrificial or mechanical structures with x number of different sacrificial structure thicknesses or mechanical structure stiffnesses and wherein the x number of sacrificial or mechanical structures are formed by x-1 depositions and x-1 masks.

Multi-thickness layers for MEMS and mask-saving sequence for same

MEMS devices are fabricated by a method that involves forming an optical element (e.g., etalon) over a substrate and then forming a light modulating element (e.g., interferometric modulator) over the optical element. In an embodiment, a support structure for the light modulating element is aligned with the underlying optical element to thereby alter the appearance of the support structure to a viewer. Such an optical element is separated from the support structure by one or more buffer layers.

MEMS device with integrated optical element

A method and apparatus for controlling waveguide birefringence by selection of a waveguide core width for a tuned top clad is described herein. In one example, a dopant concentration within a top cladding material is between 3-6% (wt.). Given a tuned top cladding composition, a width of the waveguide core is pre-selected such that birefringence is minimized, i.e., a zero, or near zero. The desirable width of the waveguide core is determined by calculating the distribution of stress in the top cladding over a change in temperature. From this distribution of stress, a relationship between the polarization dependent wavelength and variable widths of the waveguide in the arrayed waveguide grating are determined. This relationship determines a zero value, or near zero value, of polarization dependent wavelength for a given range of waveguide widths. Accordingly, the width of the waveguide may be selected such that the polarization dependent wavelength is minimized.

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Fremont, CA, United States of America

Fan Zhong