Taiyuan University of Technology

Fan Zhang

Shengbo Sang

Jianlong Ji

Xiaojie Chai

The embodiments of the present disclosure relate to the technical field of a flexible semiconductor 3D additive material, in particular to a system for printing and discharging of a flexible semiconductor 3D additive material and a control method thereof. Ink materials corresponding to different layers of a flexible semiconductor to be printed are pre-treated prior to entering troughs. The ink materials after the pretreatment flow into the multi-channel troughs, the corresponding ink materials are controlled to be sequentially extruded by gases in the corresponding troughs, intertwined and injected into interfaces, and stacked to form a stacked layer structure at end of printheads connected with the interfaces to complete discharging and printing, thereby realizing simultaneous printing of the ink materials of different viscosities and fluidities, improving the printing speed, and realizing direct printing of a sandwich structure of a semiconductor device.

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Taiyuan, China

Fan Zhang