National Taipei University of Technology

Ceram Energy Technology Co., Ltd.

Fan-Ping Chen

Sea-Fue Wang

Hsi-Chuan Lu

A stamping assembly includes an upper die, a lower die, first pins and second pins. Each of the upper and lower dies has columns of depressions and columns of guiding holes. Each column of the guiding holes is disposed between two adjacent columns of the depressions. The depressions of one of the upper and lower dies are registered with the guiding holes of another one of the upper and lower dies. The first pins and second pins are respectively positioned in the guiding holes of the upper and lower dies and extend outwardly. The first pins and the second pins are respectively arranged into first and second matrices.

Stamping assembly for preparing modular planar interconnect plate

A method for preparing a modular planar interconnect plate includes steps of a) providing a metal blank sheet having a main region and two first lateral regions, b) forming two openings respectively in the first lateral regions, and c) stamping to form protrusions and depressions at the main region on lower and upper surfaces of the metal blank sheet. In the stamping step, each of two lower surrounding protrusions and two upper surrounding depressions is formed to surround a corresponding one of the openings, and each of an upper surrounding protrusion and a lower surrounding depression is formed to surround the first lateral regions and the corresponding ones of the protrusions and depressions formed at the main region.

Method for preparing modular planar interconnect plate

A method for preparing a modular planar interconnect plate for a solid oxide fuel cell includes the steps of: (a) providing a metal blank sheet, (b) stamping a main region of the metal blank sheet to form a plurality of columns of upper protrusions on an upper surface of the main region of the metal blank sheet and a plurality of columns of lower depressions on a lower surface of the main region of the metal blank sheet, and (c) stamping the main region of the metal blank sheet to forma plurality of rows of lower protrusions on a lower surface of the main region of the metal blank sheet and a plurality of rows of upper depressions on the upper surface of the main region of the metal blank sheet.

Method for preparing modular planar interconnect plate, modular planar interconnect plate assembly including the interconnect plate, and stamping assembly for preparing the interconnect plate

Growing community of inventors

Taoyuan, Taiwan

Fan-Ping Chen