Qualcomm Incorporated

Fahad Ahmed

Chulmin Jung

Sei Seung Yoon

Mohamed Hassan Abu-Rahma

Peng Jin

Rahul Sahu

Mukund Narasimhan

Pradeep Raj

Po-Hung Chen

Keejong Kim

David Li

Changho Jung

Esin Terzioglu

Raghav Gupta

Jaeyoon Kim

Greg Seok

A method and apparatus for memory built-in self-test (MBIST) may be configured to load a testing program from an MBIST controller, execute the testing program, and determine and write pass/fail results to a read-out register. For example, in various embodiments, the testing program may comprise one or more write operations that are configured to change data stored in a plurality of memory bitcells from a first value to a second value while a byte enable signal is asserted in order to test stability associated with a memory bitcell, create DC and AC noise due to byte enable mode stress, check at-speed byte enable mode timing, and execute a self-checking algorithm that may be designed to verify whether data is received at a data input (Din) pin. Any memory bitcells storing a value different from an expected value after performing the write operation(s) may be identified as having failed the MBIST.

Byte enable memory built-in self-test (MBIST) algorithm

In an example, a method of memory repair may include receiving, by a memory repair unit, a plurality of memory identifiers. The method may include determining, by the memory repair unit, that a first memory identifier of the plurality of memory identifiers corresponds to a first memory of a plurality of memories. The method may include determining, by the memory repair unit, that a second memory identifier corresponds to a second memory of the plurality of memories. The method may include outputting, by the memory repair unit, in parallel: a first value to a repair enable input of the first memory, and a second value to a repair enable input of the second memory.

Memory repair enablement

A circuit including an output node and a cross-coupled pair of semiconductor devices configured to provide, at the output node, an output signal in a second voltage domain based on an input signal in a first voltage domain is described herein. The circuit further includes a pull-up assist circuit coupled to the output node; and a look-ahead circuit coupled to the pull-up assist circuit, wherein the look-ahead circuit is configured to cause the pull-up assist circuit to assist in increasing a voltage level at the output node when there is a decrease in a voltage level of an inverted output signal in the second voltage domain from a high voltage level of the second voltage domain to a low voltage level of the second voltage domain.

High-speed level shifter

A memory includes a memory cell, one bitline coupled to the memory cell, a sense amplifier coupled to the one bitline, a timing circuit configured to enable the sense amplifier during a read operation, a control circuit configured to enable the sense amplifier independent of the timing circuit, and a pull-up circuit configured to pull up the one bitline while the sense amplifier is enabled by the control circuit. The method includes enabling a sense amplifier in a read operation by a timing circuit. The sense amplifier is coupled to at least one bitline, and the at least one bitline is coupled to a memory cell. The method further includes enabling the sense amplifier independent of the timing circuit in a second operation and pulling up the at least one bitline by a pull-up circuit while the sense amplifier is enabled in the second operation.

Timed sense amplifier circuits and methods in a semiconductor memory

A pair of write driver inverters are arranged in series to drive a bit line responsive to a data bit input signal. A first boost capacitor provides a negative boost to a first ground node for a first one of the write driver inverters during the write assist period. A second boost capacitor provides a negative boost to a second ground node for a second one of the write driver inverters during the write assist period.

Write driver circuitry to reduce leakage of negative boost charge

A write driver is provided that includes a first write driver inverter that inverts a data signal to drive a gate of a second write driver transistor. The write driver transistor has a terminal coupled to a bit line and another terminal coupled to a boost capacitor. A ground for the first write driver inverter floats during a write assist period to choke off leakage of boost charge from the boost capacitor through the write driver transistor.

Write data path to reduce charge leakage of negative boost

A sense amplifier (SA) and a method for operating the SA are provided. The SA includes a first differential pair of transistors configured to receive a first differential input, a second differential pair of transistors configured to receive a second differential input, and a current source configured to source a current to flow through the first and second differential pairs of transistors. The method includes receiving by a first differential pair of transistors a first differential input, receiving by a second differential pair of transistors a second differential input, and flowing a current through the first and second differential pairs of transistors. A multi-bank memory is provided. The memory includes a first bank of memory cells and a second bank of memory cells sharing the disclosed SA.

Shared sense amplifier

A memory and a method to operate the memory are provided. The memory includes a plurality of memory cells and a wordline driver configured to output a wordline. The memory cells are coupled to the wordline. A control circuit is configured to supply an operating voltage to the memory cells and to the wordline driver. A voltage-adjustment circuit is configured to adjust the operating voltage supplied to the memory cells during the control circuit supplying the operating voltage to the memory cells and to the wordline driver. The method includes supplying an operating voltage to at least one memory cells and to a wordline coupled to the at least one memory cells and adjusting the operating voltage supplied to the at least one memory cells during the supplying the operating voltage to the at least one memory cells and to the wordline.

Memory with a voltage-adjustment circuit to adjust the operating voltage of memory cells for BTI effect screening

A memory and a method for operating a memory are provided. The memory includes a memory cell configured to be powered from a first voltage source, a bitline, and a write driver configured to write to the memory cell through the bitline, the write driver comprising a pull-up circuit to pull up bitline voltage towards a second voltage source while using the first voltage source to limit the bitline voltage, the first and second voltage sources being in different voltage domains.

Write driver for memory

A sense amplifier is provided with a pair of first pull-up transistors that are configured to charge a corresponding pair of output terminals while a delayed sense enable signal is not asserted and to stop charging the corresponding pair of output terminals while the delayed sense enable signal is asserted.

Sense amplifier with pulsed control for pull-up transistors

A write-assisted memory includes a pre-charge assist circuit that assists the pre-charge of the power supply voltage on a power supply lead for an accessed memory cell in a bit-line-multiplexed group of memory cells subsequent to a write-assist period by coupling charge from the power supply leads for the remaining non-accessed memory cells in the bit-line-multiplexed group of memory cells.

Write-assisted memory with enhanced speed

Various integrated circuits and methods of operating the integrated circuits are disclosed. The integrated circuit may include a circuit having one or more electrical parameters resulting from process variations during the manufacture of the integrated circuit, and a voltage source configured to supply a voltage to the circuit to power the circuit, wherein the voltage source is further configured to adjust the voltage as a function of the one or more electrical parameters.

Process tolerant circuits

An integrated circuit is disclosed. The integrated circuit includes a plurality of bit-cells arranged to store data. The integrated circuit also includes a sensor configured to generate an output for determining whether the bit-cells are operating at a process corner. The sensor comprises the same circuitry as the bit-cells.

Growing community of inventors

San Diego, CA, United States of America

Fahad Ahmed