Nxp B.v.

St-ericsson Sa

Ipdia

Bodycap

Chambre De Commerce Et D'industrie De Region Paris Ile De France

Ophtimalia

Fabrice Verjus

Patrice Gamand

Lionel Rousseau

Jean-Marc Yannou

Archit Giridhar

Philippe Cauvet

Francois Lecornec

Nicolaas J A Van Veen

Philippe Auvray

Laurie Valbin

Jean-Marc Yan-Nou

David Chevrie

Cyrille Cathelin

Philippe L L Cauvet

Peter Biemans

A method for producing a piezoelectric sensor, includes the following steps: producing, on a rigid support (), a stack of sensor layers (), the sensor layers including a layer of piezoelectric material () included between a first electrode () and a second electrode (), the first electrode not being in contact with the second electrode, then, while the sensor layers () are still held by the rigid support (), covering the sensor layers with a polymer layer (), then removing the stack of sensor layers from the rigid support (), such that the sensor layers covered by the polymer layer () are no longer carried by the rigid support ().

Method for producing a flexible piezoelectric sensor

A MEMS multiaxial inertial sensor of angular and linear displacements, velocities, or accelerations has four comb drive capacitive sensing elements integrated on a planar substrate, each sensing element having an output responsive to displacement along a Z axis, and responsive to a displacement along X or Y axes. The sensing elements are located at different parts of the substrate on both sides of the X axis and the Y axis, the outputs being suitable for subsequently deriving linear and angular displacements about any of the X, Y or Z axes. Linear or angular movement is determined from combinations of the sensor signals.

Multi-axial linear and rotational displacement sensor

A device substrate has a device major surface, a semiconductor element on the device major surface, and electrically conductive device connectors extending across the device major surface. An interconnection substrate has an interconnection substrate having an interconnection major surface, the interconnection substrate defining at least one sealing recess recessed from the interconnection major surface, the sealing recess being surrounded by a sealing ring. The device substrate is mounted on the interconnection substrate with the interconnection major surface facing the device major surface, the sealing ring around the semiconductor element and with the device major surface sealed against the sealing ring so that the recess forms a sealed cavity containing the semiconductor element. Electrical interconnects extend across the interconnection major surface. Interconnection bumps are provided outside the sealing ring to electrically connect the device to the interconnect substrate.

Integrated package

An integrated circuit assembly (ICA) comprises: a digital and/or analog integrated circuit (S) having a core with input and/or output pins and at least one power supply connection pad (PP) and one ground connection pad (GP) connected to a chosen one of the input and/or output pins and respectively connected to power supply and ground connection zones (MZ) of a printed circuit board (PCB), and a passive integration substrate (S) set on top of the digital and/or analog integrated circuit (S) and comprising i) at least first and second input zones respectively connected to the ground (GP) and power supply (PP) connection pads to be fed with input ground and supply voltages, ii) input and/or output zones connected to chosen core input and/or output pins, and &#xcb;i) a passive integrated circuit (PIC) connected to the first and second input zones and arranged to feed the substrate input and/or output zones with chosen ground and supply voltages defined from the input ground and supply voltages.

Integrated circuit assembly with passive integration substrate for power and ground line routing on top of an integrated circuit chip

A system in package () has a, preferably wireless, test controller () for testing each die () after it has been mounted onto the substrate of the system in package (), and a faulty die () is repaired before a next die () is mounted onto the substrate (). This way, the system in package () can be tested during the intermediate stages of its manufacturing, thus ensuring that all dies () function correctly before sealing the dies in the single package. Consequently, a method for manufacturing a system in package () is obtained that has an improved yield compared to known manufacturing methods.

Method of manufacturing a system in package

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Creully, France

Fabrice Verjus