Selfrag Ag

Lasag Ag

Fabrice Monti Di Sopra

Harald Giese

Reinhard Müller-Siebert

Bruno Frei

Peter Hoppe

Josef Singer

Alexander Weh

Heiko Feitkenhauer

Urs Friedli

Helena Ahlqvist Jeanneret

Klaus Leber

Bernhard Hasler

Peter Hoppé

A method for fragmenting and/or weakening material by high-voltage pulses is provided. The material and a processing fluid are arranged in a processing zone formed between two electrodes such that the entire processing zone is flooded with processing fluid, and high-voltage pulses are applied to the electrodes such that high-voltage breakdowns occur between the two electrodes and/or such that predischarge channels are formed without breakdowns. An electrode with a metallic conductor is chosen for at least one of the two electrodes, the conductor being provided partially or completely with an insulator or insulating coating at the working end of the electrode that is in contact with the processing fluid, the permittivity of the insulator/insulating coating being at least 75% of the permittivity of the processing fluid.

Method and device for fragmenting and/or weakening material by means of high-voltage pulses

A method of fragmenting and/or weakening of material is provided that utilizes high voltage discharges. The material is together with a process liquid introduced into a process area, in which two electrodes face each other at a distance, and is arranged therein in such a manner that the area between the two electrodes is filled with the material and process liquid. Between the two electrodes high voltage discharges are generated for fragmenting or weakening of the material. During the fragmenting or weakening, respectively, of the material, process liquid is discharged from the process area and process liquid is fed into the process area. The process liquid which is fed has a lower electrical conductivity than the process liquid which is discharged.

Method of fragmenting and/or weakening of material by means of high voltage discharges

The invention relates to an electrode arrangement for an electrodynamic fragmentation plant having a passage opening () for fragmentation material () and having several electrode pairs () by means of which, by charging the electrodes (--) thereof with high-voltage pulses, in each case high-voltage discharges can be generated within the passage opening (), for fragmentation of the fragmentation material (). The passage opening () is formed in such a way and the electrodes (--) of the electrode pairs are arranged therein in such a way that for each electrode pair () in the area of a shortest connecting line (L) between the electrodes of the respective electrode pair, a ball (K) can pass through the passage opening (), the diameter of which is bigger than the length of this respective shortest connecting line (L). With such an electrode arrangement it is possible to carry out an electrodynamic fragmentation of fragmentation material in an economical manner with comparatively small high-voltage pulses. This also results in the possibility of expanding the realizable target value range of existing plants considerably in the direction of larger target values by retrofitting such plants with the electrode arrangement according to the invention.

Electrode arrangement for an electrodynamic fragmentation plant

The laser device () is formed by a stack of laser diodes () arranged on plates () formed of a material that is electrically conductive and a good heat conductor. In order to obtain a high level of heat evacuation efficiency towards the cooling body () and to prevent electric short-circuiting problems, each plate has at the bottom end () thereof, an electrically insulating layer deposited on the surface thereof prior to being fixed to the cooling body by a securing material () that is preferably a good heat conductor, formed in particular by a braze layer. According to the invention, the insulating layer covers the end face of each plate and also goes up along the lateral faces of the latter over a certain height. The securing material is arranged under the end of the plate and also partially covers the insulating layer along the lateral faces of the plate.

Laser device formed by a stack of laser diodes

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Thun, Switzerland

Fabrice Monti Di Sopra