Commissariat a L'energie Atomique Et Aux Energies Alternatives

Commissariat a L'energie Atomique

Commissariat À L'énergie Atomique Et Aux Énergies Alternatives

Fabrice Jacquet

Damien Saint-Patrice

Jean-Louis Pornin

Sébastien Bolis

Sebastien Hentz

Sébastien Hentz

David Henry

Charlotte Gillot

Emmanuelle Lagoutte

Arnaud Pouydebasque

A method for metalizing at least one blind via formed in at least one substrate, including: a) arranging at least one solid portion of electrically conductive material in the blind via, b) performing a thermal treatment of the solid portion of electrically conductive material, making it melt in the blind via, cooling the electrically conductive material, solidifying it in the blind via, and wherein, before carrying out step a), at least part of the walls of the blind via is covered with a material able to prevent wetting of said part of the walls of the blind via by the melted electrically conductive material obtained during the performance of step b), the solidified electrically conductive material obtained after carrying out step c) being able not to be secured to said non-wetting part of the walls of the blind via.

Method for metalizing blind vias

A method for encapsulating a microcomponent positioned on a substrate, including: a) production of an electrical contact pad on the substrate; b) production of a portion of sacrificial material covering the microcomponent and the electrical contact pad; c) production of an encapsulation layer covering the sacrificial material and a first face of the substrate; d) production, through the substrate, of a hole aligned with the electrical contact pad and emerging at the portion of sacrificial material; e) elimination of the portion of sacrificial material through the hole; f) production, in the hole, of a conductive portion electrically connected to the electrical contact pad, forming a conductive via.

Method of encapsulation of a microcomponent

A method for producing a sealed cavity, including: a) producing a sacrificial layer on a substrate; b) producing a cover layer covering at least the sacrificial layer and a portion of the face of the substrate not covered by the sacrificial layer, the cover layer including lateral flanks forming, with the substrate, an angle of less than 90&#xb0;; c) producing a hole through one of the lateral flanks of the cover layer such that a maximum distance between the substrate and an edge of the hole is less than approximately 3 &#x3bc;m, the hole crossing a portion of the cover layer deposited on a portion of the substrate not covered by the sacrificial layer; d) eliminating the sacrificial layer through the hole, forming the cavity; and e) depositing at least one material plugging the hole in a sealed fashion.

Sealed cavity and method for producing such a sealed cavity

An interconnect device is disclosed including a support in which at least one hole is formed, the hole having walls forming a closed contour and being formed by a cavity and one or several slots communicating with the cavity. The slots extend in a direction making a non-zero angle with the main plane of the support. Several conducting elements are positioned on at least one wall of the hole and pass through the hole. The conducting elements are each intended to connect conducting areas to each other that are situated on either side of the support. At least one of the slots separates two of the conducting elements from each other.

Interconnect structure with cavity having one or several contact rises on the wall of the cavity and method for producing same

The invention relates to a method for producing a device with a membrane used to encapsulate a fluid contained in a cavity, in which:

Method for producing a device with a fluid-encapsulating membrane

Interconnect structure comprising blind vias intended to be metalized

A method for making a micro-device including at least one receiving site for components, formed in a thickness of a substrate. The method includes: a) making in at least one first substrate adhesively bonded to a second substrate via a discontinuous adhesive bonding interface, at least one first trench around at least one sacrificial block of the first substrate, by etching the first substrate so as to expose the adhesive bonding interface; and b) removing the sacrificial block so as to make at least one first cavity in the first substrate.

Method for making a cavity in the thickness of a substrate which may form a site for receiving a component

It consists of a microcomponent comprising a cavity () delimited by a cap () enclosing an active part () supported by a substrate (). The cap () comprises a top wall () comprising stiffening means with at least one projecting stiffening member (), said stiffening member () being located between two recessed areas () of the top wall () and having one end () at a distance from the recessed areas () without coming into contact with the substrate ().

Growing community of inventors

Saint Pierre de Mesage, France

Fabrice Jacquet