Alcatel Lucent

Alcatel

Alcatal Canada Inc.

Fabien Letourneau

Paul J Brown

Bevin Grant Schmidt

Nicholas Adam Bundza

Simon Paul Creasy

Gregory William Cheshire

Various exemplary embodiments relate to a light transmission device for transmitting light from at least one light source to an illuminated surface. The device may include at least one light entrance surface that allows entrance of light from the at least one light source; a light emitting surface with an area greater than the total area of the at least one light entrance surface; at least one light pipe portion extending from the at least one light entrance surface toward the illuminated surface wherein the light pipe portion internally reflects the light toward the illuminated surface; and a flared diffusion portion between the at least one light pipe portion and the light emitting surface wherein the diffusion portion internally reflects the light towards the light emitting surface. The device may be a solid piece of plastic. The light pipe portions may be curved to bend light toward the illuminated surface.

Controlled flaring light transmission device

A printed circuit board card comprising: a printed circuit board having a first thickness and having first and second edges for inserting into respective channels of card guides, the channels of the card guides for receiving printed circuit boards having a second thickness, the second thickness being greater than the first thickness; and, first and second thickness adaptors each having a third thickness applied at the first and second edges, respectively, a sum of the first and third thicknesses approximating the second thickness, to thereby align the printed circuit board in the channels of the card guides.

Printed circuit board thickness adaptors

An assembly of releasably interconnected circuit substrates is provided. The assembly has a first and second circuit substrate. Each substrate provides an electrical connector for mating electrical engagement of the first and second substrates. The assembly also has a two-position lock that is operable between a first and second position. In the first position of the lock, the first and second circuit substrates are in locked interconnection with each other. In the second position of the lock, the first and second circuit substrates are separable from each other.

Multipart electronic circuit assembly with detachably interconnecting and locking component circuit substrates

A clip for holding a heat sink in heat conductive engagement with an integrated circuit mounted upon a substrate. The clip has a resilient beam for extending across the heat sink and two arms to extend down opposite edges of the heat sink and the substrate. The arms have free end extensions. When assembled, the heat sink and substrate sandwich between them the integrated circuit and a compression spring forming part of the clip, compresses the heat sink, integrated circuit and substrate together between the spring and the free end extensions. The compression spring is compressed in turn between the heat sink and the beam which is resiliently flexed away from the heat sink. The clip is devoid of screwthreaded attachments together with their disadvantages and the spring is the sole means of holding the assembly together. The beam of the clip may be spaced from a base of the heat sink so as not to extend across cooling air passages between heat transfer projections of the heat sink. The clip does not cause electrical shorting. Loosening of the clip cannot take place in the assembly. The clip is registered with the heat sink and with the substrate to accurately locate the heat sink relative to the integrated circuit. Cooling air is funnelled through a space defined by the beam, a base of the heat sink and the two arms so as to pass the air through air flow passages of the heat sink.

Growing community of inventors

Aylmer, Canada

Fabien Letourneau