Thales

Fabien Filhol

Bertrand Leverrier

Bernard Chaumet

Claude Rougeot

Régis Quer

Pierre-Olivier Lefort

A microelectromechanical system comprising an assembly of layers stacked in a stacking direction comprises an active layer made of single-crystal silicon comprising an active structure, and first and second covers defining a cavity around the active structure, the active layer interposed between the first and second covers, the second cover comprising a single layer made of single-crystal silicon. The assembly comprises a decoupling layer made of single-crystal silicon and comprising: an attaching element fastened to a carrier, a frame encircling the attaching element in the plane of the decoupling layer, and a mechanical decoupling structure connecting the frame and the attaching structure, the mechanical decoupling structure allowing the attaching element to be flexibly joined to the frame. The frame is secured to the silicon layer of the second cover and at most one film of silicon dioxide is interposed between the frame and silicon layer of the second cover.

Microelectromechanical system and fabricating process having decoupling structure that includes attaching element for fastening to carrier

A vibrating inertial sensor is provided, micro machined in a plane thin wafer, allowing the measurement of an angular position or of an angular speed. The sensor comprises two vibrating masses suspended by springs with identical stiffness in X and Y and coupled together by identical stiffness springs in X and Y, and at least excitation transducers and detection transducers disposed on at least one of the masses. The mobile assembly consisting of a vibrating mass and the parts of transducers fastened to this mass has a generally symmetric structure with respect to an axis of symmetry OX and with respect to an axis of symmetry OY.

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Valence, France

Fabien Filhol