Bull Sas

Le Commissariat À L’énergie Atomique Et Aux Énergies Alternatives (Cea)

Le Commissariat a L'energie Atomique Et Aux Energies Alternatives

Fabien Demange

Luc Dallaserra

Nicolas Depret

Jean-Christophe Bonnin

Pascal Guilbault

Pierre Lamy

Method for manufacturing a heat sink for liquid cooling system of a compute blade of a supercomputer, comprising in particular a friction-stir welding step of a base plate at a machined central rib and at a machined rim.

Method for manufacturing a heat sink

A modular computer cabinet include an interchangeable interconnection device configured to interconnect the interconnection switch with the rackable element, the interchangeable interconnection device including a wall for connecting to a rackable element, the connection wall extending along a second plane orthogonal to the first plane of the rackable element, the connection wall including a third blindly connectable connector configured to be blindly connected to the first blindly connectable connector included in the rackable element, a cable connected to the third connector of the connection wall, the interconnection cable including a fourth connector configured to be connected to the second connector of the plurality of second connectors included in the interconnection switch.

Computer cabinet comprising devices for interconnecting interconnection switches and rackable elements

A device for spreading the floor-loading of a computer cabinet includes a bottom, an external face of which is to be positioned facing the floor. The external face of the bottom of the cabinet includes pins, each pin including at its end furthest from the bottom a head the diameter of which is greater than the diameter of a shank of the pin, the shank providing the connection between the cabinet and the pin, the load-spreading device includes at least two beams, each beam including at least two parallel flat faces: a first face includes a slot acting as a rail, the width of the slot being greater than the diameter of a pin shank but less than the diameter of a pin head, this slot collaborating with at least two pins for the installation of the beam, a second face is in contact with the floor.

Floor-loading load-spreading system for computer cabinet

The invention particularly relates to a computer device () for a computer housing center that is transportable in a container. The computer device includes at least one computer cabinet. Said computer device is sized and arranged so as to be movable inside a container into which said computer device is to be placed, and which comprises an absorber system that is suitable, with regard to said computer device, for absorbing the transmission of vibrations to the at least one computer cabinet once the computer device is installed in the container.

Information technology apparatus and associated transportable information technology hosting center

An electronic board includes a support on which first electronic components are installed, the first electronic components having a height of less than a first threshold height h; a cold plate that extends parallel to the support, the distance between the cold plate and the support being equal to the first threshold height h, the cold plate including a base plate in which at least one channel is formed through which a coolant can circulate, the base plate being fixed to a complementary plate closing the channel, the cold plate covers all first electronic components, the first electronic components being connected to the cold plate through deformable pads made of a heat conducting material.

Electronic board provided with a liquid cooling system

A heat sink for an interchangeable expansion module that can be connected to a computer board is disclosed. In one aspect, the heat sink has at least one cooling module in which a coolant flows, and at least one first electrical connector. The heat sink, wherein the expansion module has at least one second electrical connector configured to be connected to the first electrical connector of the board, and has at least one heat exchange surface, the heat sink comprising at least one heat-transfer device configured to be removably placed against the exchange surface, and the heat-transfer device further being configured such that it is in thermal contact with the cooling module and is mechanically attached, in a removable manner, to the cooling module of the board when the expansion module is connected to the board is also disclosed.

Heat sink for an interchangeable expansion module capable of being connected to a computer board

A heat sink for a processor includes: a main heat exchange zone that bears in contact with a processor; at least one peripheral heat exchange zone that bears in contact with a cooling source, and at least one heat pipe connecting the main heat exchange zone with the peripheral heat exchange zone, the heat pipe containing a cooling fluid.

Heat sink for processor

A computer blade for a rackable server includes a chassis that can be inserted into the rackable server along a reference axis, the chassis including two longitudinal faces and at least one transverse face; two lever arms, each lever arm being fixed to the chassis through a pivot link such that each lever arm is capable of pivoting relative to the transverse face between a lock position in which the lever arm extends parallel to the transverse face and a release position in which the lever arm forms an angle from the transverse face, each lever arm including a first end with at least one transverse tab projecting from one of the longitudinal faces of the chassis when the lever arm is in its lock position, the two lever arms being fixed to each other through a sliding pivot link.

Computer blade for rackable server

A hydraulic distributor capable of distributing a liquid coolant to a plurality of cooling devices, includes a liquid coolant inlet conduit into the hydraulic distributor; a plurality of supply conduits for the cooling devices by the liquid coolant, each of the supply conduits being hydraulically connected to the inlet conduit through a supply duct; a liquid coolant outlet conduit from the distributor; a plurality of liquid coolant return conduits in the distributor, each of the return conduits being hydraulically connected to the outlet conduit by a return duct; wherein at least one of the liquid coolant supply or return conduits can be fitted with a floating connector allowing for a hydraulic connection with at least one of the cooling devices among the plurality of cooling devices.

Growing community of inventors

Poissy, France

Fabien Demange