Atotech Deutschland Gmbh

Atotech Deutschland Gmbh & Co. Kg

Fabian Michalik

Josef Gaida

Dirk Tews

Michael Merschky

Thomas Thomas

Stefanie Ackermann

Lutz Brandt

Markku Lager

Norbert Lützow

Gabriela Schmidt

Wonjin Cho

Marco Haryono

Felix Tang

Tatjana Königsmann

Thomas Hülsmann

Valentina Belova-magri

Ting Xiao

Meng Che Hsieh

Belen Gil IBÀNEZ

Liu Zhiming

The present invention relates to a method for increasing adhesion strength between a surface of a metal, a metal alloy or a metal oxide and a surface of an organic material comprising as a main step contacting of at least one section of said metal, metal alloy or metal oxide with a specific azole silane compound, a specific azole silane oligomer, or a mixture comprising said compound and/or said oligomer. Furthermore, the present invention relates to a use of said specific azole silane compound, said specific azole silane oligomer, or said mixture in a method for increasing adhesion strength between a surface of a metal, a metal alloy or a metal oxide and a surface of an organic material.

Method for increasing adhesion strength between a metal and an organic material

The present invention relates to a specific azole silane compound, an oligomer thereof, a mixture comprising said compound and/or said oligomer, as well as a respective storage and working solution. Furthermore, the present invention relates to a synthesis method for said specific azole silane compound, and the use of said working solution as a surface treatment solution.

Azole silane compound

An etching solution for copper and copper alloy surfaces comprising at least one acid, at least one oxidising agent suitable to oxidise copper, at least one source of halide ions and further at least one polyamide containing at least one polymeric moiety according to formula (I) wherein each a is independently from each other selected from 1, 2 and 3; each b is an integer independently from each other ranging from 5 to 10000; each Ris a monovalent residue independently from each other selected from the group consisting of substituted or unsubstituted C1-C8-alkyl groups and a method for its use are provided. Such etching solution is particularly useful for retaining the shape of treated copper and copper alloy lines.

Etching solution for copper and copper alloy surfaces

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Berlin, Germany

Fabian Michalik