Robert Boschgmbh

Fabian Bez

Rolf Becker

Lutz Mueller

Sven Lamers

Johannes Duerr

Michael Schlecht

The invention relates to an electronic component () having a corrosion-protected bonding connection and a method for producing said component. For this purpose the electronic component () has at least one semiconductor chip () on a substrate (). Moreover, a bonding connection at risk of corrosion is provided on the semiconductor chip (). For encapsulation of the at least one semiconductor chip () and the at least one bonding connection at risk of corrosion, said semiconductor chip and bonding connection are surrounded by a hermetically sealing housing (). The hermetically sealed bonding connection is a bonding wire connection () which is fully enclosed in the housing (), in which the substrate () is at least partially enclosed. The substrate () has at least one surface-mounted hydrolysis-sensitive component () in the housing ().

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Kirchentellinsfurt, Germany

Fabian Bez