Triquint Semiconductor Corporation

Stmicroelectronics S.r.l.

Ezio Perrone

Bernd Schleicher

Antonino Scuderi

Volker Wannenmacher

Hailin Han

Christian Bildl

A radio frequency (RF) power amplifier (PA) may include a first transistor and a second transistor. A first power cell may be coupled with the first transistor, and a second power cell may be coupled with the second transistor. In embodiments, the first transistor may be scaled to operate at a first current density, while the second transistor may be scaled to operate at a second current density.

Split biased radio frequency power amplifier with enhanced linearity

Various embodiments may provide a circuit including a radio frequency (RF) power amplification module having an RF power amplifier. The RF power amplification module may further include a directional coupler coupled with the RF power amplifier and configured to produce a power signal at a coupling port of the directional coupler corresponding to an output power of the RF power amplifier. The RF power amplification module may further include a switch coupled between the coupling terminal and a sensing path to selectively couple the coupling port with a power detector via the sensing path. The RF power amplification module may further include a termination load coupled to an isolation port of the directional coupler. Some embodiments may include a plurality of RF power amplification modules coupled together by the sensing path.

Directional coupler architecture for radio frequency power amplifier

A touch sensor includes a substrate having a substrate surface and first electrode sets. Each first electrode set has a plurality of electrodes formed over the substrate surface and arranged in a row along a first direction, the electrodes being transparent and formed of a first material, the first material being electrically conductive and light transmissive. Each first electrode set also has connection elements. Each connection element provides an electrical connection between a pair of adjacent ones of the plurality of electrodes. The connection elements are formed of a second material having a smaller specific electric resistance than the first material. Each of the connection elements comprises a first portion, a second portion and a third portion. The third portion provides an electrical connection between the first portion and the second portion.

Growing community of inventors

Munich, Germany

Ezio Perrone