Siemens Aktiengesellschaft

Ewgenij Ochs

Stefan Pfefferlein

Thomas Bigl

Ulrich Wetzel

Alexander Hensler

Stephan Neugebauer

Klaus Nieberlein

Philipp Oschmann

A cooling device for heat dissipation from an electronic component includes a heating tube having a heating tube surface, a cooling element having a first cooling element side formed with a slot recess which at least partially encloses the heating tube, and a fiber structure made of fibers and arranged on the heating tube surface in a region in which the heating tube is at least partially enclosed by the slot recess. The fibers on the heating tube surface of the heating tube in the region of the slot recess form a mechanical connection with a cooling element surface of the cooling element.

Cooling device with fiber attachment between heating tube and cooling element

A semiconductor assembly includes a carrier element with a first carrier element conductor path, a semiconductor chip, an electrically insulating element having a first insulating element conductor path, and a first spacer element. The semiconductor chip is connected electrically and mechanically on a first semiconductor side via a first connecting material to the first carrier element conductor path. The semiconductor chip is connected on a second semiconductor side, which faces away from the first semiconductor side of the semiconductor chip, via a second connecting material to the first insulating element conductor path, which is arranged on a first insulating element side of the electrically insulating element. The first spacer element is arranged for maintaining a distance between the carrier element and an assembly element facing toward the second semiconductor side of the semiconductor chip and is connected mechanically to both the carrier element and the assembly element.

Semiconductor assembly and method of producing the semiconductor assembly

A semiconductor assembly includes a semiconductor element having contacts on a first surface electrically connected with contacts of a carrier element by electrically conductive material. A second surface opposite the first surface has a convex curvature with a first radius or a concave curvature with a second radius. The second surface of the convex curvature or the second surface of the concave curvature is connected in a positive-fit manner to a cooling body surface of a concave cooling body curvature of the cooling body, and, during operation at a selected barrier layer temperature, the first radius of the convex curvature deviates by at most 10% from a third radius of the concave cooling body curvature, or the second radius of the concave curvature deviates by at most 10% from a fourth radius of the convex cooling body curvature.

Semiconductor assembly

Apparatus for electrically connecting an electrical component to first and second busbars of different potential to one another during operation includes an insulation arranged between the first and second busbars and having first and second openings. The first busbar has a first busbar opening, intended as a first electrical connection, and a second busbar opening. The second busbar has a third busbar opening, intended as a second electrical connection, and a fourth busbar opening. The first opening of the insulation, the first busbar opening and the fourth busbar opening overlap, and the second opening of the insulation, the third busbar openings and the second busbar openings overlap. The insulation has a first boundary which demarcates the first insulation opening and projects into the fourth busbar opening of the second busbar, and a second boundary which demarcates the second opening and projects into the second busbar opening of the first busbar.

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Fürth, Germany

Ewgenij Ochs