Infineon Technologies Ag

Ewe Henrik

Joachim Mahler

Ivan Nikitin

Anton Prueckl

A laminate electronic device comprises a first semiconductor chip, the first semiconductor chip defining a first main face and a second main face opposite to the first main face, and having at least one electrode pad on the first main face. The laminate electronic device further comprises a carrier having a first structured metal layer arranged at a first main surface of the carrier. The first structured metal layer is bonded to the electrode pad via a first bond layer of a conductive material, wherein the first bond layer has a thickness of less than 10 &#x3bc;m. A first insulating layer overlies the first main surface of the carrier and the first semiconductor chip.

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Burglengenfeld, Germany

Ewe Henrik