Osram Opto Semiconductors Gmbh

Ewald Karl Michael Günther

Siegfried Herrmann

Korbinian Perzlmaier

Heribert Zull

Andreas Plöβl

Mathias Kämpf

Thomas Veit

Bernd Böhm

Herbert Brunner

Stefan Grötsch

Jörg Erich Sorg

Ulrich Zehnder

Jens Dennemarck

Alexander Wilm

Klaus Müller

Günter Spath

A method of producing a plurality of semiconductor chips includes a) providing a carrier substrate having a first major face and a second major face opposite the first major face; b) forming a diode structure between the first major face and the second major face, the diode structure electrically insulating the first major face from the second major face at least with regard to one polarity of an electrical voltage; c) arranging a semiconductor layer sequence on the first major face of the carrier substrate; and d) singulating the carrier substrate with the semiconductor layer sequence into a plurality of semiconductor chips.

Method of producing semiconductor chips that efficiently dissipate heat

A carrier substrate includes a first major face and a second major face opposite the first major face. A diode structure is formed between the first major face and the second major face, which diode structure electrically insulates the first major face from the second major face at least with regard to one polarity of an electrical voltage.

Carrier substrate and method for producing semiconductor chips

The invention relates to an optoelectronic component, having &#x2014;a carrier () comprising a first main surface (Ia), &#x2014;at least one optoelectronic semiconductor chip () having no substrate, and &#x2014;a contact metallization (), wherein &#x2014;the carrier () is electrically insulating, &#x2014;the at least one optoelectronic semiconductor chip () is fastened to the first main surface (Ia) of the carrier () by means of a bonding material (), particularly a solder material, &#x2014;the contact metallization () covers at least one area of the first main surface (Ia) free of the optoelectronic semiconductor chip (), and &#x2014;the contact metallization () is electrically conductively connected to the optoelectronic semiconductor chip ().

Optoelectronic component

An LED projector includes a plurality of light sources; and an image generator which includes an arrangement of pixels, each pixel including at least one light source; wherein the LEDs are stacked epi-LEDs which include layers arranged above one another for different colors, or each pixel includes an emission surface and at least two LEDs are arranged adjacent one another in the emission surface.

LED projector

Growing community of inventors

Regenstauf, Germany

Ewald Karl Michael Günther