Osram Opto Semiconductors Gmbh

Institute of Materials Research and Engineering

Other

Osram Gmbh

Osram Opto Semiconductors (malaysia) Sdn. Bhd

Agency for Science, Technology and Research

Osram Opto Semiconductor Gmbh

Infineon Technologies Ag

Ewald Guenther

Mark Auch

Chua Soo Jin

Hooi Bin Lim

Hagen Klausmann

Soo Jin Chua

Lim Shuang Fang

Hou Siong Tan

Ed Vin Soh

Shi Chai Chong

Shahrol Izzanni Abdul Manaf

David Lacey

Cheng Kooi Tan

Senthil Kumar

Ong Kian Soo

Low Bee Ling

Charles Lee Wee Ming

Low Hong Yee

Chen Zhong

Tan Hou Siong

Soh Ed Vin

Lim Hooi Bin

Stefan Eigenbrodt

Soong Lin Teng

An encapsulation for an organic light emitting diode (OLED) device is disclosed. The encapsulation includes a sealing dam surrounding the cell region of the OLED device to support a cap. Spacer particles are randomly located in the cell region to prevent the cap from contacting the active components, thereby protecting them from damage. The sealing dam provides a sealing region between the edge of the cap and dam in which an adhesive is applied to seal the OLED device. The use of the sealing dam advantageously enables devices to be formed with narrower sealing widths.

Organic electronic devices with an encapsulation

An encapsulation for a device is disclosed. Spacer particles are randomly located in the device region to prevent a cap mounted on the substrate from contacting the active components, thereby protecting them from damage. The spacer particles comprise a base and an upper portion, the base being at least equal to or wider than the upper portion, for preventing the generation of dark spots around the spacer particles.

Encapsulation of electronic devices with shaped spacers

An electroluminescent device having a protection layer in the cap bonding region to which the cap is bonded. The protection layer can be formed from photosensitive or non-photosensitive materials. The protection layer protects the layers below from being damage during removal of polymer materials.

Encapsulation for electroluminescent devices

A method of encapsulating a device is disclosed. Spacer particles are randomly located in a device region to prevent a cap mounted on the substrate from contacting the active components when pressure is applied to the cap, thereby protecting the active components from damage. The spacer particles comprise a base and an upper portion, the base being at least equal to or wider than the upper portion.

Encapsulation of electroluminescent devices with shaped spacers

An encapsulation for a device is disclosed. Spacer particles are randomly located in the device region to prevent a cap mounted on the substrate from contacting the active components, thereby protecting them from damage. The spacer particles are fixed to one side of the substrate to prevent any movement.

Encapsulation of electronic devices

An OLED device having pillars, wherein the pillars serve to pattern a conductive layer during deposition. The profile of the pillars covers the edges of at least one functional layer to protect it from exposure to potentially deleterious substances.

Patterning of electrodes in OLED devices

A method of encapsulating a device is disclosed. Spacer particles are randomly located in the device region to prevent a cap mounted on the substrate from contacting the active components, thereby protecting them from damage. The spacer particles are fixed to one side of the substrate to prevent any movement.

A method to ensure uniform deposition of organic layer is disclosed. Since the organic layer is very thin, any deviation from the target thickness will result in visible optical defects. A homogenous layer which exhibits good coating behaviour with organic materials is provided beneath the organic layer. By covering the metal interconnects, the adverse effect on the uniformity of the polymer layer is reduced or prevented.

Uniform deposition of organic layer

A device having bond pads within a bond pad region, the bond pads comprising a conductive material that is stable when exposed to atmospheric constituents. The bond pads can be formed from conductive oxide materials such as indium tin oxide. A contact layer is provided to enhance the conductivity between the bond pads and the active component of the device.

Interconnection for organic devices

A reinforcement technique used in the fabrication of displays, such as organic light emissive diode (OLED) display, is disclosed. A stiff reinforcement lid is mounted on a thin substrate to encapsulate the OLED cells. The lid serves to reinforce the thin flexible substrate and protect it from breakage. It comprises preferably of metal or other materials that have higher stiffness and ductility than the thin substrate. The fabricated display is compatible for integration into chip cards and other flexible applications.

Reinforcement of glass substrates in flexible devices

An OLED device capable of emitting multiple colors is disclosed. In one embodiment of the invention, multiple substrates are stacked upon one another, wherein the different substrates emit light of a given color. In another embodiment of the invention, these substrates are separated by spacer particles to prevent the overlying substrates from contacting the active components.

Multi substrate organic light emitting devices

Disclosed is a technique for increasing the shelf life of devices, such as OLED which requires hermetic sealing from moisture and oxygen with out increasing the bonding width. In one embodiment, the permeation path of moisture or oxygen is increased without increasing the bonding width. This is achieved by using a grooved interface between the cap and substrate on which the components of the device are formed. The grooved interface can comprise various geometric shapes.

Sealing for OLED devices

An OLED device having a conductive layer patterned by pillars to form electrodes in the device is disclosed, wherein portions of the pillars have at least 2 sub-rows to prevent shorting of adjacent electrodes. In one embodiment, the ends of the pillars are split into at least 2 sub-rows.

Robust electrode patterning in OLED devices

The present invention relates to an apparatus with electro-luminescent components having one or more layers of organic active material. The electrodes are structured in such a way that the apparatus's layers are protected during structuring and the components may be tightly packed together to improve display resolution. The display includes two electrode layers in addition to the at least one organic layer. The display also includes a first layer and a second layer that form a structure with an overhang. The overhang prevents at least two electrodes from one of the electrode layers from contacting one another. The second layer includes a cross-linked material.

Structured electrodes

An encapsulation procedure for an organic light emitting diode (OLED) device, especially for thin and therefore flexible substrates, is disclosed. The device is sealed hermetically against environmental and mechanical damage. The procedure includes the use of a thin cover lid holder and a substrate holder that are designed to handle thin substrates without damaging them. Thin substrates ensure sufficient mechanical flexibility for the OLED devices, and provides an overall thickness of less than 0.5 mm.

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Singapore, Singapore

Ewald Guenther