International Business Machines Corporation

Ewald E Stadler

Scott Marvin Thorvilson

Edward Allan Highum

Thomas William Nash

Alfred Wilhelm Mueller

Helmut Schettler

Heinz G Horbach

Harald W Gruber

Kurt Hinrichsmeyer

An enclosure for an electronic device forms a barrier to electro-magnetic radiation. A typical cross-section of the enclosure comprises three parallel layers. The outer and inner surface layers are of a polymeric base material in which is suspended an electrically conductive fill material, giving the surface layers relatively high electrical conductivity. The middle layer is of a polymeric base material, in which is suspended fill material having high magnetic permeability, giving the middle layer relatively high magnetic permeability. In the preferred embodiment, the enclosure is constructed using a co-injection molding process. Nickel-coated graphite (high conductivity) in a polymeric base is injected into a mold from the outer co-injection nozzle, while carbonyl iron powder (high permeability) in a polymeric base is injected into the mold from the inner co-injection nozzle. The resultant molded structure contains the three layers described above, yet can be made inexpensively in a single co-injection molding operation. The enclosure may comprise multiple co-injection molded pieces, which are attached together by any of various conventional means.

Method for manufacturing electro-magnetic shield having multiple

An enclosure for an electronic device forms a barrier to electro-magnetic radiation. A typical cross-section of the enclosure comprises three parallel layers. The outer and inner surface layers are of a polymeric base material in which is suspended an electrically conductive fill material, giving the surface layers relatively high electrical conductivity. The middle layer is of a polymeric base material, in which is suspended fill material having high magnetic permeability, giving the middle layer relatively high magnetic permeability. In the preferred embodiment, the enclosure is constructed using a co-injection molding process. Nickel-coated graphite (high conductivity) in a polymeric base is injected into a mold from the outer co-injection nozzle, while carbonyl iron powder (high permeability) in a polymeric base is injected into the mold from the inner co-injection nozzle. The resultant molded structure contains the three layers described above, yet can be made inexpensively in a single co-injection molding operation. The enclosure may comprise multiple co-injection molded pieces, which are attached together by any of various conventional techniques.

Electro-magnetic shielding structure having surface layers connected to

An electronic package (11) which comprises a substrate (12) having several chips (13) arranged thereon, and a plurality of connector pins (26) fitted in pin plates (21-24) and electrically connected via conductors to the chips (13). Each pin plate is mounted by means of at least one flexible connector element (29) connected to the conductors at a respective peripheral section (16-19) of the substrate (12). The pin plates have a base surface in the form of any discretionary polygon, in such a manner that, when folded, form a plane substantially flush with the plane of the substrate (12) into a position beneath the substrate (12), or vice versa. Thus an electronic package is obtained which is less complex in its manufacture and covers a considerably reduced base surface while offering a comparable performance.

Electronic package

This invention concerns a ceramic substrate for mounting semiconductor integrated circuits. The substrates include at least a first and second patterned metallization layer which respectively form conducting planes that are parallel to each other but separated by a thickness of insulation. The pattern metallization of at least the first plane includes signal conductors for joining the contacts of the integrated circuit chip to pins provided in the substrate for connecting the substrate and chip to a circuit board. In accordance with the invention, the metallization of the second plane includes shorted conductor loops that follow the contour of the signal conductors. The shorted loops of the second plane metallization includes branches which extend parallel to both lateral sides of a respective signal conductor. In accordance with the invention, the branches of the loops are joined at their ends.

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Herrenberg, Germany

Ewald E Stadler