Stratasys, Inc.

Velo3d, Inc.

Applied Materials, Inc.

Applied Materials Israel Limited

Evgeni Levin

Benyamin Buller

Tasso Lappas

Gilad Almogy

Eduardo Napadensky

Daniel Dikovsky

Erel Milshtein

Yoav Bressler

Shai Hirsch

Efrat Rozenman

Yehuda Cohen

Scott Beaver

Guy Menchik

Alexander Libinson

Alan Rick Lappen

Yacov Elgar

Robert Michael Martinson

Rueben Joseph Mendelsberg

Daniel I Some

Kevin Ready Campion

Richard Joseph Romano

Sergey Korepanov

Andrew James Carlson

Andrei Korobkov

Nathaniel Michael Peterson

Scott Wayne Beaver

Robert Earl Simon

Jonathan Bennhard Hedlund

Joe Tralongo

Mirta Perlman

Thomas Blasius Brezoczky

The present disclosure provides three-dimensional (3D) methods, apparatuses, software (e.g., non-transitory computer readable medium), and systems for the formation of at least one desired 3D object; comprising use of a geometric model, a physics based model, one or more markers, one or more modes, or any combination thereof. The disclosure provides reduction of deformation that may be caused by the forming process of the 3D object.

Three-dimensional objects and their formation

A method of printing a three-dimensional (3D) object and a support construction for the 3D object includes depositing a model material, layer-by-layer, on a fabrication platform, to print a first portion of the 3D object, and depositing a support material, layer-by-layer on the fabrication platform, to print the support construction, wherein, in a predetermined number of the deposited layers, the model material and the support material are deposited such that a gap is formed between a surface of the first portion of the 3D object and a surface of the support construction.

Apparatus for printing three-dimensional (3D) objects

Method for printing three-dimensional (3D) objects

A system for three-dimensional printing is disclosed. The system comprises: a rotary tray configured to rotate about a vertical axis; a printing head, each having a plurality of separated nozzles; and a controller configured for controlling the inkjet printing head to dispense, during the rotation, droplets of building material in layers, such as to print a three-dimensional object on the tray.

Method and system for rotational 3D printing

Some embodiments of the invention may be related to a system and method of printing a three-dimensional (3D) object and a support construction for the 3D object. The system may include a printing unit and a supply system for supplying a body material and a support material to the printing unit. The system may further include a controller be configured to: generate 3D cross sectional digital data comprising a set of horizontal slices, to manipulate the 3D digital data to create a set of shifted slices by performing vertical shifts between body regions and support regions of a same horizontal slice to create printing digital data and to control the printing unit to deposit, in layers, the body material and the support material based on the printing digital data, wherein in a single scan, droplets of the support material and droplets of the body material travel different distances.

Method and apparatus for printing three-dimensional (3D) objects

The present disclosure provides three-dimensional (3D) printing methods, apparatuses, systems, and non-transitory computer-readable medium. The disclosure delineates real time manipulation of three-dimensional printing to reduce deformation. The present disclosure further provides 3D object formed using the methods, apparatuses, and systems.

Adept three-dimensional printing

The present disclosure provides three-dimensional (3D) printing methods, apparatuses, and systems using, inter alia, a controller that regulates formation of at least one 3D object (e.g., in real time during the 3D printing); and a non-transitory computer-readable medium facilitating the same. For example, a controller that regulates a deformation of at least a portion of the 3D object. The control may be in situ control. The control may be real-time control during the 3D printing process. For example, the control may be during a physical-attribute pulse. The present disclosure provides various methods, apparatuses, systems and software for estimating the fundamental length scale of a melt pool, and for various tools that increase the accuracy of the 3D printing.

Accurate three-dimensional printing

A method for inspecting a substrate for defects, including: A method for inspecting a substrate for defects, the method including the steps of: (i) obtaining at least two wafer element detection signal; each wafer element detection signal reflects light scattered to a distinct direction; each wafer element detection signal having a wafer element detection value; (ii) calculating at least one wafer element attribute value in response to the at least two wafer element detection signals; retrieving at least one reference wafer element attribute value, each wafer element attribute value corresponding to a reference wafer element attribute value; and (iii) determining a relationship between the at least one reference wafer element attribute value, wafer element attribute value and at least one threshold to indicate a presence of a defect.

Multi-detector defect detection system and a method for detecting defects

A method to extend the process monitoring capabilities of a semiconductor wafer optical inspection system so as to be able to detect low-resolution effects of process variations over the surface of a wafer at much higher sensitivity than heretofore possible. The method consists, in essence, of grouping sensed pixels by geometric blocks over the inspected surface and comparing each block with a corresponding one from another die on the same wager, from another wager of from a stored model image. In one embodiment of the invention, pixel values are compared directly and differences are thresholded at a considerably lower level than during a defects detection process. In another embodiment, there is calculated a signature for each block, based on the sensed light intensity values, and corresponding signatures are compared.

System and method for process variation monitor

A method for inspecting a substrate for defects, including: (a) obtaining an inspected pixel and a reference pixel; (b) calculating an inspected value and a reference value, the inspected value representative of the inspected pixel and the reference value representative of the reference pixel; (c) selecting a threshold in response to a selected value out of the inspected value and the reference value; and (d) determining a relationship between the selected threshold, the reference value and the inspected value to indicate a presence of a defect.

Method for detecting defects

A method to extend the process monitoring capabilities of a semiconductor wafer optical inspection system so as to be able to detect low-resolution effects of process variations over the surface of a wafer at much higher sensitivity than heretofore possible. The method consists, in essence, of grouping sensed pixels by geometric blocks over the inspected surface and comparing each block with a corresponding one from another die on the same wafer, from another wafer or from a stored model image. In one embodiment of the invention, pixel values are compared directly and differences are thresholded at a considerably lower level than during a defects detection process. In another embodiment, there is calculated a signature for each block, based on the sensed light intensity values, and corresponding signatures are compared.

Growing community of inventors

Rehovot, Israel

Evgeni Levin