Hewlett-Packard Development Company, L.p.

Hewlett Packard Enterprise Development LP

Compaq Information Technologies Group, L.p.

Compaq Computer Corporation, Inc.

Everett R Salinas

Kevin B Leigh

John P Franz

Qiang Wang

Mark A Peterson

George D Megason

John Robert Grady

Herbert J Tanzer

David F Bolognia

Ralph M Tusler

David A McAfee

Sagi Varghese Mathai

John Norton

Michael L Chan

Joseph R Allen

Kuang-Yi Wu

Wade David Vinson

Harvey John Lunsman

Troy Anthony Della Fiora

Patrick A Raymond

Jeffery Michael Giardina

Eric Mei

Allen T Morrison

Edgar Hance

Richard Barnett

Sung-Hsia Kuo

Luke Lloyd Wardensky

James R Duncan

Mike L Pelonero

Gerald J Merits

Billy E Buller, Jr

Lindall W Gay, Jr

Switch sub-chassis systems and methods for rack-scale servers are disclosed. A switch sub-chassis is arranged for modular installation in an enclosure and includes structural support features that allow multiple hot-serviceable line-cards and an integrated high-density optical fiber connectivity within the sub-chassis. Various features of the switch sub-chassis and associated line-cards allow liquid-electro-optical blindmate of the line-cards so that the line-cards are serviceable, allow high-density and complex fiber shuffle assemblies support, and facilitate ease of installation and/or servicing of fiber assemblies.

Switch sub-chassis systems and methods

A lock mechanism for a faceplane infrastructure coupled externally from a faceplate of a modular device includes a locking bar, a locking bar engagement element, and a securing device. When the lock mechanism is assembled and in a locked state, the locking bar is housed within the modular device. Further, when the lock mechanism is assembled and in the locked state, the locking bar engagement element is fixedly coupled to a first portion of the faceplane infrastructure and removably engaged with the locking bar through an aperture in the faceplate of the modular device. Moreover, when the lock mechanism is assembled and in the locked state, the securing device locks the first portion of the faceplane infrastructure to the faceplate of the modular device.

Lock for faceplane infrastructure

Example implementations relate to an electronic system providing a thermal management of a removable device when connected to a host device of the electronic system. The host device includes a cooling component having a first surface, and a plurality of first blocks of magnetic materials coupled to the cooling component. The removable device includes a heat spreader having a second surface, a plurality of second blocks of magnetic materials coupled to the heat spreader, and a TIM disposed on the second surface. The removable device is detachably connectable to the host device. When the removable device is connected to the host device, and magnetic forces applied by at least one of the first blocks or second blocks to couple respective blocks to each other, the first blocks is aligned with the second blocks such that the first surface is in thermal communication with the second surface through the TIM.

Magnetic blocks for thermally coupling cooling component and heat spreader

A shuffle assembly for a computing device comprises at least one chassis waveguide shuffle block having a plurality of chassis inputs and a plurality of chassis outputs, and having a plurality of optical waveguides formed therein connecting the chassis inputs to the chassis outputs in a desired chassis shuffle arrangement. The shuffle assembly may further comprise at least one line card waveguide shuffle block having a plurality of line card inputs, at least one of the plurality of line card inputs, a plurality of line card outputs, and a plurality of waveguides formed therein connecting the plurality of line card inputs to the plurality of line card outputs in a line card shuffle arrangement. At least one optical ribbon cable may couple the at least one chassis waveguide shuffle block to the at least one waveguide shuffle block.

Waveguide shuffle blocks for optical system connectivity

A faceplate optical sub-assembly is provided for accommodating a plurality of optical receptacles mounted in a faceplate of a computing device. The faceplate optical sub-assembly accommodates one or more optical receptacle housings having optically-connected front and rear optical bays. A collar having a single aperture surrounds the one or more optical bays, and a shell structure comprised of a pair of interlocking sub-shells engages on the rear of the collar. A gasket is disposed between the collar and the shell structure. The collar, gasket, and shell structure provide electromagnetic interference (EMI) shielding for optical connections made between optical fibers inserted in the front and rear optical bays, and rigidly engage the plurality of optical receptacle housings. The single aperture of the collar and the multi-part shell structure allows for insertion of a fiber jumper assembly into the rear bays of the faceplate optical sub-assembly prior to insertion into a faceplate of a computing device.

Modular faceplate optical sub-assembly

A system is provided for connecting a plurality of different enclosures within rack. Enclosures can be stacked and contain a plurality of articulating arm assemblies configured to mate with each other. Each articulating arm assembling may comprise a side plenum, arm plenum, plenum pivot, and at least one knuckle housing. One or more knuckle housings of each articulating arm assembly configured to connect with one or more knuckle housing of a different articulating arm assembly. Each articulating arm assembly configured to move to at least a open and an closed position. Each knuckle housing of each articulating arm assembly includes a plurality of optical connector arrays configured to mate with corresponding optical connector arrays of a different articulating arm assembly. Each knuckle housing may further include at least one retention feature configured to retain coupling of a knuckle housing with a corresponding knuckle housing.

Fist-bump optical connector blindmating among multiple enclosures in a rack

Hot-pluggable optical modules for high-density optical signaling are provided. The modules comprise a dual-purpose heat spreader configured to function as a thermal component and including trenches accommodating optical infrastructure. The dual-purpose heat spreader includes a trench for routing optical fibers to and from a plurality of optical connectors, each disposed on a branch of the fiber harness assembly and configured to mate with a socket on a module board through an opening in the dual-purpose heat spreader.

Electro-optical hot-pluggable module with a dual-purpose heat transfer plate

A line-card comprising: an optical blindmate connector to connect to the midplane of the switch sub-chassis; and a printed circuit board (PCB) including: an application specific integrated circuit (ASIC); an electrical blindmate connector to connect to a midplane of a switch sub-chassis; and a liquid blindmate connector to connect to the switch sub-chassis.

Line-card

A system may include a component cage to house a heat-generating component, a cold plate assembly, and a mounting mechanism. The cold plate assembly may include a cold plate having a mating surface and a non-mating surface, the mating surface to contact a thermal transfer device of a heat-generating component installed in the component cage. The mounting mechanism movably mounts the cold plate to the component cage with the non-mating surface facing a surface of the component cage located in a first plane. The mounting mechanism allows the cold plate to move from a first orientation to a second orientation as the heat-generating component is being installed in the component cage. In the first orientation, the mating surface is inclined relative to the first plane. In the second orientation, the mating surface is parallel to the first plane when the heat-generating component is installed in the component cage.

Floating liquid-cooled cold plate

A modular optical connector system is provided for connecting a plurality of different rack enclosures, separate racks, and/or sets of racks. A first plenum has a receptacle configured to connect with a plug in a second plenum. The receptacle comprises a plurality of receptacle sub-housings, each receptacle sub-housing comprising an array of optical ferrules configured to mate with corresponding optical ferrules in a plurality of plug sub-housings of the plug. Each plug sub-housing having a lever tab rotatably connected and configured to mate with mating components on the corresponding receptacle sub-housing. Each sub-housing pair remaining unconnected after the receptacle and plug are mated, each sub-housing pair being independently mated.

Individually blind-mated modular optical connectors of optical ferrule arrays in a group of sub-housing pairs within a main housing pair

A high-density universally-configurable system board architecture for use with multiple mid-board optic (MBO) type configurations is provided. The system board comprises a switch application specific integrated circuit (ASIC) assembly, a plurality of MBO interfaces comprising a plurality of via-in-pad plated over (VIPPO) vias, and a plurality of mounting holes. Each MBO interface is configured to mate with a soldered-down MBO assembly or a socket instance comprising a socketized MBO assembly. Each socketized MBO assembly comprises an interposer comprising a plurality of VIPPO vias, where the bottom contact pad of each VIPPO via is thicker than the top contact pad. Either configuration is facilitated without the need to modify the system board layout.

High-density universally-configurable system board architecture with dual-use modular mid-board optics (MBOs)

Systems and methods are provided for a nested co-blindmate high-density optical switch system. The nested co-blindmate high-density optical switch system can include a system enclosure, and an enclosure midplane that is installed the system enclosure. Further, a switch chassis can be enclosed by the system enclosure, and liquid blindmate to a liquid line on a rack; optically blindmate to at least one blade in the system enclosure; and electrically blindmate to the enclosure midplane. At least one optical switch line-card can be included in the system, which is enclosed by the switch chassis, and further enclosed by the system enclosure in a nested manner. The at least one optical switch line-cards can liquid blindmate to the switch chassis, optically blindmate to the switch chassis, and electrically blindmate to the enclosure midplane.

Nested co-blindmate optical, liquid, and electrical connections in a high density switch system

Liquid chamber housings are described herein. In one example, an apparatus for liquid chamber housings can include a first housing segment coupled to a first side of a board and a second housing segment coupled to a second side of the board to create a liquid chamber for a portion of the board between the first housing segment and the second housing segment.

Liquid chamber housings

An ejectable/retractable interface module is disclosed. AN exemplary interface module may include a display trolley assembly, and a display module pivotally connected to the display trolley assembly. A management cable connects the display module to a computer board in the display trolley assembly. The display trolley assembly and display module are configured for during ejection and retraction in a blade enclosure so that the display module folds flat and retracts into the blade enclosure to reduce damage during shipping. The display module pivots to a desired viewing angle during use.

Growing community of inventors

Houston, TX, United States of America

Everett R Salinas